Serviceable CPU Assembly with Sleeve and Handle

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Solution Overview

Problem

Accessing and servicing central processing units (CPUs) in electronic devices is challenging due to their low profile and limited accessibility, requiring trained personnel and complex tools for removal and installation.

Innovation Solution

An electronic device design featuring a serviceable CPU assembly with an opening in the cover, a sleeve extending to the circuit board, and a CPU carrier that can be inserted into a channel, along with a handle assembly for easy installation and removal, including guidance features and a thermally connected heat sink for alignment and cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the CPU is mounted directly to the circuit board with limited access, then the device structure is compact and stable, but the CPU becomes difficult to access and service

Engineering Contradiction:
ImproveCPU accessibilityVSAvoidInstallation complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The CPU assembly is segmented into separate components: a CPU carrier with the CPU, a heat sink assembly, and a cover assembly. This segmentation allows the CPU to be accessed and serviced independently without disassembling the entire device, resolving the contradiction between compact structure and CPU accessibility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A sleeve is introduced as an intermediary component that extends from the cover opening to the circuit board, providing a guided pathway for the CPU carrier. This mediator enables easy CPU installation and removal through the cover opening while maintaining structural stability, addressing both accessibility and installation complexity concerns.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the CPU has a low profile to maintain compact device size, then the device is compact, but the CPU is covered and requires removal of covers and components for access

Engineering Contradiction:
ImproveDevice volumeVSAvoidCPU serviceability
Core Design Contradiction:
Volume of moving objectVSEase of repair

Solution Approach 1:

The CPU assembly is designed to be accessed vertically through a cover opening rather than requiring horizontal disassembly of internal components. This dimensional change in access approach allows the CPU to remain low-profile while being serviceable through the cover, maintaining compact device volume while improving ease of repair.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sleeve is pre-installed in the cover with guidance features that prepare the pathway for CPU carrier insertion. This preliminary action enables straightforward CPU installation and removal without requiring removal of other device components, enhancing serviceability while keeping the device compact.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If specialized tools and ESD grounding straps are required for CPU installation, then the CPU installation is reliable and protected, but the installation process becomes complex and requires trained personnel

Engineering Contradiction:
ImproveCPU installation reliabilityVSAvoidInstallation ease
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The CPU carrier and sleeve are designed with self-aligning guidance features including ribs and grooves that automatically guide the CPU carrier into proper position during insertion. This self-service design eliminates the need for specialized alignment tools and complex installation procedures, making the process accessible to untrained personnel while maintaining installation reliability.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accessible and efficient installation and removal of the CPU without removing the device cover, simplifying the process for users and reducing the need for advanced tools, while maintaining thermal management through the heat sink.

Implementation Method 1

a CPU carrier thermally connected to an underside of a lower portion of a heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9448597B2Electronic device with serviceable CPU
Publication Date: 2016.09.20 LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
  • US9448597B2 patent drawing
  • US9448597B2 patent drawing
  • US9448597B2 patent drawing

AI summary

An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.