Seven-Facet Transfer Chamber Layout for Smaller Wafer Tool Footprint
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Solution Overview
Problem
Current semiconductor processing tools have a large footprint due to the use of multiple transfer chambers and vias, which occupies valuable space in fabrication facilities and limits productivity.
Innovation Solution
A semiconductor processing tool platform configuration with a single transfer chamber having seven facets, where four larger facets attach to processing chambers and three narrower facets attach to auxiliary chambers and a load lock, reducing the overall footprint and enabling efficient substrate transfer using robots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple transfer chambers and vias are used to enable substrate transfer between processing chambers, then substrate transfer capability is improved, but the tool footprint increases significantly
Solution Approach 1:
The patent combines multiple transfer chambers into a single integrated transfer chamber with multiple facets. Instead of using separate transfer chambers for different substrate transfer paths, the invention creates one transfer chamber that can interface with multiple processing chambers (four facets) and auxiliary chambers (three facets) simultaneously, thereby reducing the overall tool footprint while maintaining comprehensive substrate transfer capability.
Solution Approach 2:
The transfer chamber is designed as a multi-functional component that serves multiple purposes: transferring substrates between four different processing chambers, interfacing with three auxiliary chambers, and connecting to the load lock. This universal design allows a single transfer chamber to perform the functions previously requiring multiple dedicated transfer chambers, thus reducing footprint while preserving adaptability.
2Area of stationary object
If a single transfer chamber with multiple facets is used to reduce footprint, then tool footprint is reduced, but the complexity of chamber configuration increases
Solution Approach 1:
The transfer chamber is segmented into multiple distinct facets (four for processing chambers, three for auxiliary chambers), each with specific attachment points and interface configurations. This segmentation allows the complex functionality to be organized into manageable, standardized interface modules, making the overall configuration more systematic and easier to implement despite the multi-faceted design.
3Area of stationary object
If narrower facets are used for auxiliary chambers to optimize space, then space utilization is improved, but the attachment precision requirements increase
Solution Approach 1:
Different facets of the transfer chamber are designed with different widths and attachment characteristics tailored to their specific functions. The four facets for processing chambers have larger dimensions suitable for high-capacity substrate transfer, while the three facets for auxiliary chambers have narrower dimensions optimized for their specific attachments. This local quality differentiation allows space optimization for auxiliary chambers while maintaining appropriate precision standards for each interface type.
Data Source
AI summary
A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.