SFP+ Cage Thermal Conduction Wrap for Dense Transceiver Cooling

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Solution Overview

Problem

Conventional SFP+ connector cages face challenges in cooling high-power transceivers due to thin steel walls, small vent perforations, and large rear connectors, leading to heat trapping and inefficient air velocity, which worsens with multiple transceivers stacked in close proximity, resulting in overheating and malfunction.

Innovation Solution

The implementation of a thermal conduction system using thin conduction plates wrapped around the cage to direct heat to an external heat sink, combined with strategically placed slits and fingers to enhance heat transfer and airflow, while maintaining electromagnetic interference integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thin steel walls and small vent perforations are used in conventional SFP+ connector cages, then the cage structure is compact and easy to manufacture, but heat is trapped inside leading to overheating of transceivers

Engineering Contradiction:
Improvetransceiver temperatureVSAvoidcage structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

A thermal conduction plate is introduced as an intermediary component between the transceiver and the external environment. The plate conducts heat away from the transceiver and transfers it to the cage structure, which then dissipates the heat to the surrounding air, effectively mediating the heat transfer process without requiring direct modification of the transceiver or cage design

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conduction plate is extracted from the traditional cage structure and positioned to contact the transceiver directly. This separate thermal management component is then integrated with the cage through thermal contact, allowing heat to be extracted from the transceiver and transferred to the cage's external surfaces for dissipation

Inventive Principle:
Principle #2Taking out (Extraction)

2Quantity of substance

If multiple transceivers are stacked in close proximity to increase density, then space utilization is improved, but heat accumulation increases leading to inefficient cooling

Engineering Contradiction:
Improvetransceiver densityVSAvoidcage internal temperature
Core Design Contradiction:
Quantity of substanceVSTemperature

Solution Approach 1:

The thermal conduction plate extends in multiple dimensions within the cage structure, with portions contacting transceivers at different levels and positions. This three-dimensional thermal conduction network efficiently transfers heat from densely packed transceivers to various parts of the cage structure, enabling effective cooling even when transceivers are stacked in close proximity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If conventional cooling methods are used with thin steel walls, then the cage maintains structural simplicity, but air velocity is insufficient leading to poor heat dissipation

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcooling system complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The thermal conduction plate is merged with the cage structure through direct thermal contact, creating an integrated heat dissipation system. The plate becomes an extension of the cage's thermal management capability, combining the transceiver cooling function with the existing cage structure without requiring separate active cooling components

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat from high-power transceivers by conducting it to a rear-mounted heat sink, reducing temperature rise within the cage and ensuring proper cooling even in densely packed configurations.

Implementation Method 1

thin conduction plates wrapped around the cage to direct heat to an external heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3982560B1Thermal conduction system for plugs in a cage
Publication Date: 2024.06.19 CISCO TECHNOLOGY INC
  • EP3982560B1 patent drawingFigure 1
  • EP3982560B1 patent drawingFigure 2A~2B
  • EP3982560B1 patent drawingFigure 2C

AI summary

An apparatus is provided. The apparatus comprises a cage having a plurality of receptacles. The apparatus also comprises a cover covering at least a portion of the cage and having a cover first side and a cover back side. The apparatus also comprises a side wrap comprising a side wrap back portion arranged to cover at least a portion of the cover back side, a side wrap side portion arranged to cover at least a portion of the cover first side, and at least one side finger arranged to extend through a slit in the cover into the cage. The apparatus also comprises a heat sink attached to the side wrap back portion.