Conductive Cooling for SFP Transceivers via Thermal Pad

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Solution Overview

Problem

Existing cooling methods for small form-factor pluggable (SFP) transceivers in network switches, such as fans and complex designs, are costly and inefficient for maintaining the designed operating temperatures, necessitating a more effective cooling solution.

Innovation Solution

A conductive cooling assembly for SFP transceivers using a thermally conductive pad and spring fingers that contact the transceiver to transfer heat to a cooling block, providing a thermally conductive path for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fans or complex cooling designs are used for SFP transceivers, then cooling capability is improved, but cost and device complexity increase

Engineering Contradiction:

Improvetransceiver operating temperatureVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces mechanical cooling systems (fans) with a passive thermal conduction system using thermally conductive materials. The thermally conductive pad transfers heat from the transceiver to the cooling block through thermal conduction, eliminating moving mechanical parts and reducing system complexity while maintaining effective heat dissipation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the essential cooling function from complex mechanical systems and isolates it into a dedicated thermal management module consisting of a thermally conductive pad and cooling block. This modular approach simplifies the overall system by separating the cooling function from other transceiver components

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If fans or complex cooling designs are used for SFP transceivers, then cooling capability is improved, but cost increases

Engineering Contradiction:

Improvetransceiver operating temperatureVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent employs inexpensive thermally conductive materials such as thermally conductive adhesive or pad instead of expensive mechanical cooling components. These passive thermal management materials are cost-effective and can be easily integrated during the manufacturing process, significantly reducing overall system cost while maintaining adequate cooling performance

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

By replacing expensive mechanical cooling systems (fans, heat sinks with active cooling) with passive thermal conduction materials, the patent achieves cost reduction. The thermally conductive pad and adhesive provide effective heat transfer without requiring complex mechanical assemblies, thereby lowering manufacturing costs

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If fans or complex cooling designs are used for SFP transceivers, then cooling capability is improved, but efficiency decreases

Engineering Contradiction:

Improvetransceiver operating temperatureVSAvoidcooling efficiency

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The patent replaces energy-consuming mechanical cooling systems with passive thermal conduction that requires no external energy input. The thermally conductive pad naturally conducts heat from the transceiver to the cooling block through thermal gradient, eliminating energy losses associated with mechanical fans and active cooling systems

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The thermal management system is self-regulating through natural thermal conduction. The thermally conductive pad automatically transfers heat from hotter regions (transceiver) to cooler regions (cooling block) without requiring external control or energy input, achieving energy-efficient passive cooling

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The conductive cooling assembly effectively maintains the SFP transceiver within its designed operating temperatures, reducing costs and improving efficiency compared to traditional cooling methods.

Implementation Method 1

a thermally conductive pad and spring fingers that contact the transceiver to transfer heat to a cooling block, providing a thermally conductive path for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11086081B2Conductive cooling for small form-factor pluggable (SFP) fiber optic transceivers

Publication Date: 2021.08.10 SCHWEITZER ENGINEERING LABORATORIES INC

AI summary

The present disclosure relates to conductive cooling of a small form-factor pluggable (SFP) transceiver. For example, an SFP transceiver assembly may include a cooling block and a thermally conductive pad having a thermally conductive material. The SFP transceiver assembly may include a spring finger that contacts the thermally conductive pad while the SFP transceiver is inserted into the SFP transceiver assembly to allow heat to be conducted from the SFP transceiver to the cooling block via the thermally conductive pad to conductively cool the SFP transceiver.