SFP-DD Module Segmentation for High Port Density

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Solution Overview

Problem

Current high-speed datacenter networks face challenges in achieving high port density with 100G connections due to limitations in existing SFP modules, which often require multiple ports and are not downward-compatible with SFP modules, leading to increased cost and power consumption.

Innovation Solution

The development of a double-density small form-factor pluggable (SFP-DD) module that incorporates two high-speed signal channels within the SFP package, maintaining compatibility with existing SFP modules and allowing for higher bandwidth while supporting high port density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If multiple ports are configured to operate as a port channel to support higher bandwidth, then bandwidth requirement is met, but port density of the switch is reduced

Engineering Contradiction:
ImprovebandwidthVSAvoidport density
Core Design Contradiction:
PowerVSProductivity

Solution Approach 1:

The SFP-DD module segments the communication channels by providing two separate high-speed signal channels (first set of communication connector pins and second set of communication connector pins) within a single module, allowing each channel to operate independently at high speed while the module itself occupies only one physical port

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent merges two high-speed communication channels into a single SFP-DD module housing, combining the functionality of what would traditionally require multiple separate modules or port channels into one integrated unit that maintains high port density

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If 100G SFP module is used to facilitate high port density, then port density is improved, but compatibility with existing SFP modules is lost

Engineering Contradiction:
Improveport densityVSAvoidcompatibility
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The SFP-DD module achieves universality by incorporating both a first set of communication connector pins compatible with existing SFP modules and a second set of communication connector pins for additional high-speed channels, allowing the same module to provide both backward compatibility and enhanced functionality

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent adds another dimension to the SFP module by including additional communication connector pins beyond the standard SFP configuration, enabling the module to support both traditional single-channel applications and new dual-channel high-speed applications without sacrificing compatibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Power

If QSFP modules are used for high bandwidth connections, then bandwidth is improved, but device complexity and cost increase

Engineering Contradiction:
ImprovebandwidthVSAvoidmodule complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The SFP-DD module provides dynamic functionality by allowing the second set of communication connector pins to be selectively activated or deactivated based on bandwidth requirements, enabling the module to adapt between single-channel and dual-channel modes without requiring different physical modules

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the operational parameters of the module by enabling optional activation of the second communication channel, allowing the same physical module to operate at different bandwidth levels (single-channel or dual-channel) based on system requirements, thereby reducing complexity for applications that don't need maximum bandwidth

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP3602844B1High-density small form-factor pluggable module and housing
Publication Date: 2021.12.22 ALIBABA GROUP HOLDING LTD
  • EP3602844B1 patent drawingFigure 1A
  • EP3602844B1 patent drawingFigure 1B
  • EP3602844B1 patent drawingFigure 2A

AI summary

Embodiments described herein provide an apparatus for facilitating a double-density small form-factor pluggable (SFP-DD) module. The apparatus includes a set of control connector pins for exchanging control signals. The apparatus also includes a first set of communication connector pins for establishing a first communication channel and a second set of communication connector pins for establishing a second communication channel. The set of control connector pins and the first set of communication connector pins correspond to connector pins of an SFP module, and the second set of communication connector pins extends the SFP module. The size of the SFP-DD module corresponds to the size of the SFP module.