SFP+ Optical Fiber Amplifier Layout for Hot-Pluggable EDFA Modules
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Solution Overview
Problem
Existing optical fiber amplifiers face challenges in achieving compatibility with small form-factor pluggables (SFP+) packages while maintaining a compact size and enabling hot plugging.
Innovation Solution
An optical fiber amplifier design compatible with an SFP+ package, featuring a housing with a module unlocking mechanism, a compact internal structure, and a hybrid optical fiber configuration to minimize space and facilitate hot plugging, along with a circuit device and optical path device within the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the EDFA is designed with a compact appearance and reduced volume to meet integration requirements, then the integration requirement is improved, but the ability to realize hot plugging deteriorates
Solution Approach 1:
The EDFA is divided into modular components including a pump module, optical path module, and control module that can be independently assembled and replaced. The housing is designed as a separable structure with a base and cover plate, allowing maintenance and replacement without replacing the entire device, thus enabling hot plugging while maintaining compact size.
Solution Approach 2:
The EDFA housing is designed with a universal SFP+ compatible interface that allows the device to be plugged into standard SFP+ slots. The card edge connector and unlocking mechanism provide universal compatibility with existing SFP+ infrastructure, enabling hot plugging functionality while maintaining a compact form factor.
2Volume of moving object
If the EDFA is designed with a compact appearance to meet integration requirements, then the integration requirement is improved, but the compatibility with standard packages deteriorates
Solution Approach 1:
The EDFA housing is designed with a universal SFP+ compatible interface that allows the device to be plugged into standard SFP+ slots. The card edge connector and unlocking mechanism provide universal compatibility with existing SFP+ infrastructure, enabling hot plugging functionality while maintaining a compact form factor.
Solution Approach 2:
The optical path device uses a ring structure configuration with strategically positioned optical components that optimize the optical path within the constrained compact volume. The erbium-doped fiber is arranged in a ring structure that maximizes the interaction length while minimizing the overall device footprint, maintaining SFP+ compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a compact, plug-and-play optical fiber amplifier that meets SFP+ package standards, supports hot plugging, and maintains stable output power with minimal space and power consumption, suitable for high-density integrated networks.
Implementation Method 1
the elastic member can be compressed to unlock the housing and the installation cage of the optical fiber amplifier compatible with an SFP+ package, and the sliding piece can return to a default state under elastic force of the elastic member when the pull ring is released
Implementation Method 2
an accommodation space is arranged in the housing; both the circuit device and the optical path device are located in the accommodation space, and the optical path device is located below the circuit device
Data Source
AI summary
An optical fiber amplifier compatible with a small form-factor pluggables (SFP+) package includes a housing, and a circuit device and an optical path device that are disposed in the housing, where the housing includes a structure compatible with an SFP+ package and is provided with an accommodation space; both the circuit device and the optical path device are located in the accommodation space, and the optical path device is located below the circuit device; the circuit device is provided with a card edge connector, and the card edge connector can be exposed outside the housing. The optical fiber amplifier compatible with an SFP+ package has a compact internal space. The amplifier has an appearance compatible with a standard SFP+ package. An electrical interface pin also meets a requirement of an existing SFP+ package, and dynamic plugging and plug-and-play can be satisfied.