SFP Transceiver Layer 3 IP Echo Response Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional Small Form-factor Pluggable (SFP) optical transceivers, used for network testing, are limited to Layer 2 testing and require external power, leading to increased costs, space consumption, and potential thermal issues, while also facing compatibility and mechanical interference challenges.

Innovation Solution

An enhanced SFP transceiver with a compact form factor capable of performing Layer 3 testing, incorporating an optical interface, electrical interface, and a control unit with an IP address, allowing for packet processing and using protocols like ICMP for network diagnostics, along with a universal interface that provides additional functionality and power independently of the host device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional SFP transceivers are used for network testing, then physical layer (Layer 1) and data link layer (Layer 2) testing can be performed, but network layer (Layer 3) testing capability is missing

Engineering Contradiction:

Improvetesting capabilityVSAvoidprotocol processing capability

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines Layer 3 IP echo response functionality directly into the SFP transceiver device, merging physical layer optical/electrical conversion, data link layer framing, and network layer IP processing into a single integrated unit. This allows the SFP to perform comprehensive Layer 1, 2, and 3 testing capabilities simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The enhanced SFP transceiver is designed to perform multiple functions across different OSI layers: physical layer signal conversion, data link layer Ethernet framing, and network layer IP echo response processing. This multi-functionality eliminates the need for separate testing devices for each layer.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If external power is provided to SFP transceivers, then additional functionality can be supported, but power consumption increases and thermal issues arise

Engineering Contradiction:

Improvetransceiver functionalityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The SFP transceiver is designed to operate using power provided by the host network device (switch or router) into which it is plugged. The device self-manages its power requirements through the standard SFP power interface, eliminating the need for external power supplies and reducing thermal issues associated with additional power sources.

Inventive Principle:

Principle #25Self-service

3Volume of moving object

If SFP transceivers are integrated into network equipment, then space is saved, but mechanical interference and compatibility challenges occur

Engineering Contradiction:

Improvedevice sizeVSAvoidmechanical integrity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent maintains the segmented architecture where the SFP transceiver is a separate, hot-pluggable module that interfaces with the host network device through a standardized mechanical and electrical interface. This segmentation allows the SFP to be easily installed, removed, and replaced without affecting the host device, while maintaining reliable electrical connections through the standardized interface.

Inventive Principle:

Principle #1Segmentation

4Productivity

If Layer 3 testing is implemented in SFP transceivers, then network diagnostics improve, but device complexity increases

Engineering Contradiction:

Improvenetwork diagnostics efficiencyVSAvoidprotocol processing capability

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent integrates IP echo response processing capability directly into the SFP transceiver, combining physical layer optical/electrical conversion, data link layer Ethernet framing, and network layer IP protocol processing in a single device. This merging enables comprehensive Layer 3 network diagnostics at the transceiver level without requiring separate testing equipment.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9549234B1Methods and apparatuses for implementing a layer 3 internet protocol (IP) echo response function on a small form-factor pluggable (SFP) transceiver and providing a universal interface between an SFP transceiver and network equipment

Publication Date: 2017.01.17 ENGINUITY COMMUNICATIONS CORP

AI summary

A small form factor pluggable device (SFP) or other compact transceiver device is provided at a subscriber's site and is configured to perform Layer 3 testing (e.g., ICMP echo request and response operations) for testing connectivity across networks. A universal interface coupling a conventional transceiver to host equipment is also disclosed which has components that can provide additional functionality to the transceiver while maintaining compatibility between the transceiver and the host equipment.