Shadow Frame With Detachable Lip For Substrate Protection
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Solution Overview
Problem
Current shadow frames for semiconductor processing chambers have sharp corners that can damage substrates, and mechanical stress during expansion and contraction leads to arcing, which can damage the substrate, susceptor, and chamber components.
Innovation Solution
A shadow frame design featuring a detachable lip that reduces the weight and contact pressure on the substrate, minimizing chipping and breaking, and includes a recessed structure to prevent arcing by controlling the gap between shadow frame pieces and the substrate, using a unibody or multi-piece shadow frame body with a detachable lip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a shadow frame with clamping mechanisms and sharp corners is used to prevent edge and backside deposition, then deposition control is improved, but substrate damage occurs due to scratching and fracturing
Solution Approach 1:
The shadow frame corners are rounded instead of sharp, eliminating the scratching and fracturing of substrates during contact while maintaining the deposition masking function. The rounded corners allow smooth contact with the substrate edge without concentrating stress at sharp points.
Solution Approach 2:
The shadow frame is designed with flexibility to conform to substrate expansion and contraction during processing, preventing mechanical stress damage while maintaining contact for deposition control. The flexible design allows the frame to adapt to thermal changes without causing substrate fracture.
2Manufacturing precision
If a shadow frame is positioned to contact the substrate for deposition masking, then edge and backside deposition is prevented, but mechanical stress from thermal expansion and contraction causes substrate damage
Solution Approach 1:
The shadow frame incorporates flexible materials or结构设计 that allow it to expand and contract with the substrate during thermal cycling, eliminating mechanical stress that would otherwise cause substrate damage while maintaining continuous contact for effective deposition masking.
Solution Approach 2:
The shadow frame design changes physical parameters such as material composition and structural geometry to accommodate thermal expansion, allowing the frame to maintain contact with the substrate through temperature variations without causing damage.
3Manufacturing precision
If a shadow frame is positioned close to the substrate to prevent deposition, then deposition control is improved, but arcing occurs between the shadow frame and substrate
Solution Approach 1:
The rounded corners of the shadow frame prevent sharp edge contact with the substrate, eliminating the conditions that lead to arcing while maintaining sufficient proximity for effective deposition masking. The curved surfaces distribute electrical field more evenly, preventing discharge.
4Ease of operation
If a shadow frame with clamping mechanisms is used to hold the substrate, then substrate positioning is improved, but sharp corners cause scratching and fracturing
Solution Approach 1:
The shadow frame corners are rounded to eliminate scratching and fracturing of substrates during handling and positioning, while the frame maintains sufficient contact pressure through its overall structure to securely hold the substrate on the support member.
Data Source
AI summary
Device for processing a substrate are described herein. An apparatus for controlling deposition on a substrate can include a chamber comprising a shadow frame support, a substrate support comprising a substrate supporting surface, a shadow frame with a shadow frame body including a first support surface, a second support surface opposite the first surface, and a detachable lip connected with the shadow frame body. The detachable lip can include a support connection, a first lip surface facing the substrate, a second lip surface opposite the first lip surface, a first edge positioned over the first support surface, and a second edge opposite the first edge to contact the substrate.