Shallow-Depth EFEM Robot Layout for Compact Wafer Transfer

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing equipment front-end modules (EFEMs) in semiconductor processing tools have a large footprint due to the depth requirements for robot arms and clearance zones, limiting the number of tools that can be housed in a fabrication facility.

Innovation Solution

Designing EFEMs with a shallower depth and simplified robot mechanisms, utilizing single-link or telescoping robot arms that minimize rotational joints, allowing for efficient wafer transfer within a compact enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional robot arms with multiple rotational joints are used in EFEM, then the robot can achieve complex wafer transfer motions, but the EFEM footprint increases due to depth requirements for robot arms and clearance zones

Engineering Contradiction:

Improverobot motion capabilityVSAvoidEFEM footprint

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The robot arm is divided into multiple segments (first robot arm segment, second robot arm segment, third robot arm segment) connected by rotational joints, allowing complex motions to be achieved through coordinated rotation of individual segments rather than requiring a large single-link mechanism

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The robot arm operates in three-dimensional space with rotational joints providing movement in multiple dimensions, enabling complex wafer transfer paths within a compact EFEM footprint by utilizing vertical and lateral space efficiently

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If EFEM depth is reduced to minimize footprint, then more tools can be housed in a given area, but the robot arm may not have sufficient space to operate

Engineering Contradiction:

ImproveEFEM footprintVSAvoidrobot arm operation space

Core Design Contradiction:

Area of stationary objectVSEase of operation

Solution Approach 1:

The robot arm segments are designed to nest within each other during retraction, with the second segment positioned within the first segment and the third segment within the second segment, minimizing the depth requirement when the robot is not in use while maintaining full operational capability when extended

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The robot arm employs dynamic positioning where the rotational joints can rotate between operational positions (extending the arm for wafer transfer) and retracted positions (minimizing depth), allowing the EFEM to maintain compact footprint while providing sufficient operation space when needed

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20250250125A1Shallow-depth equipment front end module with robot

Publication Date: 2025.08.07 LAM RES CORP

AI summary

Shallow-depth equipment front end modules are provided that use one or more robot arms that have no rotational joints, other than at the robot arm shoulder. In some such implementations, robot arms may pick and place wafers from or into FOUPs or load locks by coordinating translational movement of the robot arm base with rotation of the robot arm relative to the robot arm base. In some other such implementations, the robot arm(s) used may be telescoping arms and the translational movement of the robot arm base and the rotation of the robot arm relative to the robot arm base may be decoupled.