Shape Memory Attachment Structures for Electronic Device Assembly

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Solution Overview

Problem

Existing methods for assembling electronic devices face challenges with adhesives, such as difficulty in dispensing and controlling them, leading to potential disassembly of joined structures over time, and increasing manufacturing tolerances result in bulky designs.

Innovation Solution

The use of shape-changing attachment structures formed from materials like polymers, foam, gel, shape memory metal, and their combinations, which expand or shrink to align and secure electronic device components, utilizing heat or other energy sources for activation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesives are used to join device structures, then attachment is achieved, but dispensing and control become difficult and structures may push apart over time

Engineering Contradiction:

Improveattachment strengthVSAvoiddispensing and control

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent changes the physical state and properties of the attachment material from traditional liquid adhesives to shape memory materials that can transition between different states (e.g., from rigid to compliant) in response to environmental changes like temperature. This allows the material to be easily dispensed in one state and then transform to provide strong attachment in another state, resolving the contradiction between ease of manufacture and attachment strength.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite materials that combine shape memory alloys or polymers with adhesive properties. These composite attachment structures integrate the shape memory effect with bonding capability, allowing for both easy application and strong, stable attachment that prevents structures from pushing apart over time.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If manufacturing tolerances are increased to address adhesive issues, then assembly becomes easier, but device design becomes bulky and cumbersome

Engineering Contradiction:

Improveassembly easeVSAvoiddevice compactness

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The shape memory attachment structures can precisely control their physical parameters (shape, volume, stiffness) through environmental triggers. This precision eliminates the need for increased manufacturing tolerances while maintaining ease of assembly, as the materials self-adjust to achieve proper fit and attachment without requiring bulky clearance or adjustment space.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The attachment structures perform self-alignment and self-adjustment through their shape memory effect, automatically compensating for minor dimensional variations. This self-correcting capability maintains tight manufacturing tolerances while preserving device compactness, as no additional clearance or adjustment mechanisms are needed.

Inventive Principle:

Principle #25Self-service

3Volume of moving object

If thin layers of adhesive are used to save space, then device compactness is improved, but control and application become more challenging

Engineering Contradiction:

Improvedevice compactnessVSAvoidadhesive control

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The shape memory materials can be applied in thin layers similar to traditional adhesives, maintaining device compactness. However, their ability to change physical parameters in response to environmental stimuli allows for easier control during application - they can be dispensed in a compliant state for easy placement, then transformed to a rigid state for precise positioning and strong attachment, eliminating the control challenges of thin adhesive layers.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise alignment and secure attachment of electronic device structures without the need for bulky fasteners, maintaining alignment and preventing disassembly, while allowing for compact and efficient design.

Implementation Method 1

The attachment structures may be formed from polymers, foam, gel, shape memory metal, adhesive, other materials, and combinations of these materials. The attachment structures may expand or shrink during device assembly operations.

Methodology Applied

Scientific EffectShape memory effect: Shape Memory Alloy

Implementation Method 2

The attachment structures can include heat-activated attachment structure, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10162392B2Electronic device structures joined using shrinking and expanding attachment structures

Publication Date: 2018.12.25 APPLE INC

AI summary

An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.