Shape Memory Resin Layers for Curved-Surface Wiring Protection

The substrate is divided into multiple independent wiring lines that can meander independently. Each wiring line is segmented into multiple sections connected at angles, allowing individual lines to deform without transmitting stress across the entire substrate. This segmentation enables the substrate to conform to curved surfaces while protecting individual wiring lines from damage.

The wiring lines are designed with meander shapes and curved paths instead of straight lines. This curvature allows the wiring lines to flex and bend when the substrate is stretched or conform to curved surfaces, distributing mechanical stress along the curved path rather than creating concentrated stress points that would damage straight wiring lines.

The meander shape and buffering structures are applied locally only at critical stress points and wiring line intersections, rather than uniformly across the entire substrate. This localized application provides protection where needed while minimizing the overall area increase. The buffering structures are positioned specifically at corners and bending zones where stress concentration occurs.

The patent applies buffering structures and meander designs to only the portions of the substrate that require stress protection, rather than uniformly across the entire substrate. This partial application maintains wiring reliability in high-stress areas while minimizing the overall area occupation and maintaining substrate efficiency in low-stress regions.