Shape Memory Housing for Adaptive Thermal Management
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Solution Overview
Problem
Current housing materials for electronic/electrical components fail to dynamically control thermal conductivity in response to ambient temperature fluctuations, leading to inadequate heat insulation or radiation, which affects component performance and longevity.
Innovation Solution
A housing using a shape memory material with an inner and outer panel configuration, where a metal plate and shape memory material form or interrupt a heat transfer path based on temperature changes, allowing for adjustable thermal conductivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a housing using a composite containing filler with high thermal conductivity is used to improve heat radiation, then thermal conductivity is improved, but heat insulation performance deteriorates
Solution Approach 1:
The patent employs a shape memory material that dynamically changes its thermal conductivity in response to temperature variations. When the temperature exceeds a predetermined threshold, the material transforms from a bent state (interrupting heat transfer path) to a straight state (forming continuous heat transfer path), enabling adaptive thermal management that resolves the contradiction between heat radiation and heat insulation requirements
Solution Approach 2:
The patent changes the physical state and thermal conductivity parameter of the housing material through temperature-induced phase transformation of the shape memory material. The material transitions between different crystalline phases (martensite and austenite) at specific temperature points, causing significant changes in thermal conductivity to optimize heat transfer or insulation based on operating conditions
2Object-affected harmful factors
If separate foaming or plastic materials with low thermal conductivity are used to improve heat insulation, then heat insulation performance is improved, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into a single housing structure by incorporating shape memory material that can provide both heat insulation (when bent to interrupt heat path) and heat radiation (when straightened to form heat transfer path). This eliminates the need for separate insulating materials and complex multi-layer structures, reducing device complexity while maintaining dual functionality
Solution Approach 2:
The patent merges the housing structure with the thermal management function by making the housing itself capable of dynamic thermal control through shape memory material. This integration combines structural support and adaptive thermal regulation into one component, avoiding the need for additional separate insulating or heat-dissipating components
3Temperature
If a blower is utilized or coolant is applied to enhance heat radiation performance, then heat radiation is improved, but weight increases
Solution Approach 1:
The patent enables the housing to self-regulate its thermal properties in response to temperature changes without requiring external power sources, blowers, or coolant systems. The shape memory material automatically transforms based on ambient temperature, providing passive thermal management that enhances heat radiation when needed without adding the weight of active cooling components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal conductivity, enhancing heat radiation at high temperatures and providing insulation at low temperatures, thereby maintaining component performance and reducing weight while addressing the limitations of existing materials.
Implementation Method 1
a strip of shape memory material extending from an inner surface of the inner panel and attached or detached to/from the metal plate on the outer panel while changing into an original straight shape or a bent shape according to a temperature variation
Implementation Method 2
When the temperature of an internal heat source rises, the shape memory material forms a heat transfer path while being straightened to contact the metal plate
Implementation Method 3
at a low temperature environment, the shape memory material is bent and separated from the metal plate to interrupt the heat transfer path
Data Source
AI summary
Disclosed is a housing for electronic/electrical that includes an inner panel and an outer panel, a strip of metal plate, and a strip of shape memory material. The inner panel and the outer panel are disposed parallel to each other at regular intervals to define an internal space. The strip of metal plate extends from an inner surface of the outer panel. The strip of shape memory material extends from an inner surface of the inner panel and is attached or detached to/from the metal plate on the outer panel while changing into an original straight shape or a bent shape according to a temperature variation. Here, when the temperature increase beyond a first transition temperature, the shape memory material straightens to form a heat transfer path. At a low temperature environment, the shape memory material bends and is separated from the metal plate to interrupt the heat transfer path.