Shape Memory Polymer Substrate for Semiconductor Die Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing pick-and-place process for attaching semiconductor dies to substrates is time-consuming and inefficient, particularly due to the need for precise alignment and the sequential nature of die placement.
Innovation Solution
A method utilizing a shape memory polymer substrate that is initially cured in a flat shape, folded to match the closer proximity of semiconductor dies on a wafer, bonded to the wafer, and then expanded to separate individual dies, allowing for simultaneous bonding and singulation of multiple dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick-and-place process is used to attach semiconductor dies to substrates, then individual dies can be placed on substrates, but the process is time-consuming and inefficient
Solution Approach 1:
The patent combines multiple operations (die placement, alignment, and bonding) into a single wafer-level bonding step. The substrate is bonded directly to the semiconductor wafer containing multiple dies, eliminating the need for sequential pick-and-place operations for each individual die, thereby significantly improving productivity and reducing time loss.
Solution Approach 2:
The substrate is pre-formed with a shape memory polymer that can be deformed into a folded configuration. This preliminary shaping allows the substrate to automatically align with the die pattern on the wafer during bonding, eliminating the need for time-consuming alignment procedures and enabling faster die placement.
2Manufacturing precision
If substrate is designed with fixed die receiving portions, then precise alignment can be achieved, but the substrate cannot accommodate varying die patterns
Solution Approach 1:
The substrate incorporates a shape memory polymer that can dynamically change its shape between a flat cured shape and a folded operational shape. This dynamic capability allows the substrate to adapt to different die patterns by adjusting its folded configuration, while maintaining precise alignment during the bonding process through the temporary folded shape.
Solution Approach 2:
The substrate utilizes changes in physical parameters (shape, temperature) of the shape memory polymer to achieve different configurations. By changing the temperature or applying specific stimuli, the polymer transitions between shapes, enabling the substrate to accommodate various die patterns while maintaining manufacturing precision during bonding.
3Productivity
If wafer-level bonding is implemented, then multiple dies can be bonded simultaneously, but the substrate must be expanded and singulated after bonding
Solution Approach 1:
The substrate is designed as a single integrated structure that can be singulated into multiple individual substrate-die assemblies after wafer-level bonding. This segmentation approach allows all dies to be bonded simultaneously to the complete substrate, maximizing bonding throughput, while the subsequent singulation step separates them into individual units for final assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for die placement and alignment, enabling faster wafer-level bonding and separation of individual dies compared to traditional methods, while accommodating varying die patterns without requiring precise initial substrate spacing.
Implementation Method 1
expanding the shape memory polymer to its first shape and singulating the shape memory polymer to separate the first and second dies
Data Source
AI summary
An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.