Shape Memory Substrate for 3D OLED Assembly

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Solution Overview

Problem

The production of 3D or 2.5D organic light-emitting diode (OLED) displays and luminous surfaces often results in defects due to the necessity of applying mechanical pressure, which can introduce particle contaminations and lead to short circuits, as existing methods require force to overcome the restoring forces of the 3D-shaped holders.

Innovation Solution

A method involving a substrate with a shape memory material that is reshaped from a non-planar to a planar state for optoelectronic component formation, and then back to a non-planar state without external mechanical pressure, using phase transitions or mechanical reshaping, to create a 3D or 2.5D appearance without damaging the components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If external force is applied to fix the OLED luminous surface on a 3D-shaped holder, then the 3D appearance is achieved, but particle contamination and short circuits occur in the OLED

Engineering Contradiction:

Improve3D appearanceVSAvoidOLED defect-free operation

Core Design Contradiction:

ShapeVSReliability

Solution Approach 1:

The substrate is pre-shaped into a non-planar configuration before the OLED is mounted. This preliminary shaping allows the holder to naturally assume its 3D form without requiring forceful deformation after assembly, thereby preventing particle contamination and short circuits while achieving the desired 3D appearance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Instead of forcing the substrate into a 3D shape after mounting the OLED, the invention inverts the sequence by pre-forming the substrate into the target 3D shape before assembly. This reverse approach eliminates the need for damaging external forces during the mounting process

Inventive Principle:

Principle #13The other way round (Inversion)

2Shape

If pressure is exerted on the active area of the OLED to overcome holder restoring forces, then the 3D shape is achieved, but defects are introduced in the OLED

Engineering Contradiction:

Improve3D appearanceVSAvoidOLED integrity

Core Design Contradiction:

ShapeVSManufacturing precision

Solution Approach 1:

The substrate is pre-shaped into the final 3D configuration before the OLED assembly process. This preliminary action ensures that no additional pressure or deformation forces are required during mounting, thereby maintaining OLED integrity while achieving the desired 3D shape

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention replaces the mechanical force application system with a pre-formed geometric system. Instead of using external actuators or tools to force the substrate into shape, the substrate itself is manufactured in the target configuration, eliminating mechanical stress on the OLED

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Shape

If the substrate is reshaped after forming the optoelectronic component, then the 3D appearance is achieved, but mechanical loading occurs on the component

Engineering Contradiction:

Improve3D appearanceVSAvoidMechanical stress on component

Core Design Contradiction:

ShapeVSObject-affected harmful factors

Solution Approach 1:

The substrate is pre-formed into the target 3D shape before the optoelectronic component is assembled. This preliminary action eliminates the need for post-assembly reshaping, thereby avoiding mechanical stress and damage to the sensitive optoelectronic component while still achieving the desired 3D appearance

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method prevents defects in optoelectronic components by eliminating the need for external forces during reshaping, allowing for the creation of 3D or 2.5D OLED devices with reduced mechanical loading, thus enhancing production efficiency and component reliability.

Implementation Method 1

reshaping the substrate into a second state having a planar or substantially planar shape... reshaping the substrate into a third state which is identical or substantially identical to the first state

Methodology Applied

Scientific EffectPhase transition: Phase Change

Implementation Method 2

using techniques like clamping and phase transitions to stabilize the substrate and maintain the desired 3D or 2.5D shape

Methodology Applied

Scientific EffectMechanical force: Mechanical Force

Data Source

PatentUS10693088B2Method for producing an optoelectronic device, and an optoelectronic device produced by the method

Publication Date: 2020.06.23 DOLYA HOLDCO 5 LTD

AI summary

In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.