Shape Memory Thermal Interface for Missile Electronics
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Solution Overview
Problem
Missile systems face challenges in managing electronic temperature fluctuations between benign environments and high-speed flight, where current thermal management techniques increase mass, volume, and cost.
Innovation Solution
A shape memory material-based thermal coupler/decoupler system using a thermal interface with a shape memory material and thermally-conductive material, which can change configuration from expanded to compressed to manage heat dissipation and insulation effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electronics are thermally coupled to the airframe, then heat dissipation is improved in benign environments, but electronics overheat in high-speed flight
Solution Approach 1:
The patent employs a shape memory material-based thermal interface that dynamically changes its thermal coupling state between coupled and insulated configurations. This dynamic adaptation allows the system to automatically adjust thermal connectivity based on flight conditions, resolving the contradiction between heat dissipation needs in benign environments and heat isolation needs in high-speed flight without requiring manual intervention or complex control systems.
Solution Approach 2:
The invention utilizes temperature-induced parameter changes in shape memory materials to transition the thermal interface between coupled and insulated states. The material's phase transition properties enable automatic adjustment of thermal conductivity based on temperature thresholds, allowing the system to adapt to different thermal environments and resolve the contradiction between maintaining electronics below temperature limits while accommodating varying flight conditions.
2Temperature
If electronics are insulated from the airframe, then electronics remain cool in high-speed flight, but electronics overheat in benign environments
Solution Approach 1:
The shape memory material-based thermal interface provides dynamic adaptability by automatically transitioning between insulated and coupled states based on thermal conditions. This eliminates the need for fixed thermal insulation configurations and enables the system to adapt to both high-speed flight conditions requiring insulation and benign environments requiring heat dissipation, thereby resolving the contradiction.
Solution Approach 2:
The invention leverages temperature-dependent parameter changes in shape memory materials to automatically adjust thermal connectivity. When temperature thresholds are exceeded, the material undergoes phase transitions that change its thermal interface properties, enabling automatic adaptation between insulated and coupled states to prevent electronics overheating in both high-speed flight and benign environments.
3Temperature
If thermal coupling is changed at launch, then thermal management is optimized, but system mass and volume increase
Solution Approach 1:
The patent utilizes parameter changes in shape memory materials that undergo phase transitions at specific temperature thresholds. This enables the thermal interface to automatically change its coupling state without requiring additional actuators, motors, or complex mechanical systems, thereby achieving optimized thermal management while minimizing increases in system mass and volume.
Solution Approach 2:
The shape memory material-based thermal interface is self-actuating through temperature-induced phase transitions. The material automatically transitions between coupled and insulated states based on thermal conditions without requiring external control systems, power sources, or additional mechanical components. This self-service mechanism achieves thermal management optimization while avoiding the mass and volume penalties associated with active thermal control systems.
4Temperature
If thermal coupling is changed at launch, then thermal management is optimized, but system cost increases
Solution Approach 1:
The invention exploits parameter changes in shape memory materials through temperature-induced phase transitions to achieve automatic thermal coupling adjustment. This passive, temperature-driven mechanism eliminates the need for complex control systems, sensors, and actuators that would increase manufacturing cost. The simple yet effective approach achieves optimized thermal management while maintaining cost-effectiveness through minimal system complexity.
Solution Approach 2:
The shape memory material-based thermal interface operates autonomously through temperature-induced self-actuation, requiring no external power sources, control electronics, or mechanical actuation systems. This self-service capability dramatically reduces system complexity and manufacturing cost compared to active thermal control systems, while still achieving optimized thermal management through automatic adaptation between coupled and insulated states.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat management in missile systems by allowing electronics to dissipate heat pre-launch and remain insulated post-launch, reducing the need for costly and heavy thermal management systems, while also serving as a low-cost, lightweight thermal switch or sensor.
Implementation Method 1
a shape memory material based thermal coupler/decoupler
Implementation Method 2
a thermally-conductive material
Data Source
Figure 1
Figure 2~4
Figure 3
AI summary
A thermal interface (108, 208, 400) is provided. The thermal interface includes a shape memory material (402) and a thermally-conductive material (404). The thermal interface is configured to be formed as a compressed thermal interface (108b, 208b) and as an expanded thermal interface (108a, 208a). The compressed thermal interface is configured to partially fill a thermal gap (106, 206) between a first component (102, 202) and a second component (104, 204). The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.