Shaped Abrasive Member for Substrate Division and Side Surface Formation
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Solution Overview
Problem
The existing substrate processing methods, such as step cutting, require multiple blades and steps, increasing man-hours and working time, and fail to efficiently form inclined or stepped side surfaces on chips.
Innovation Solution
A substrate processing method using a shaped abrasive member with projections having inclined or vertical side surfaces to simultaneously cut substrates along division lines and form inclined or stepped side surfaces, reducing the number of man-hours and working time by fully cutting the substrate with a single operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If step cutting is used to form inclined or stepped side surfaces on chips, then the desired side surface shape is achieved, but the number of man-hours and working time are increased
Solution Approach 1:
The patent combines multiple cutting functions into a single blade structure. The blade includes both a first cutting edge for initial cutting and a second cutting edge for finishing cuts, allowing both roughing and finishing operations to be performed in one continuous process rather than requiring separate step cutting operations.
Solution Approach 2:
The blade is designed with multi-functionality by incorporating different cutting edges with varying characteristics. The first cutting edge has different properties than the second cutting edge, enabling the same blade to perform multiple cutting stages (rough cutting and finishing cutting) without requiring blade changes or multiple specialized blades.
2Shape
If step cutting is used to form inclined or stepped side surfaces on chips, then the desired side surface shape is achieved, but the number of man-hours is increased
Solution Approach 1:
The patent combines multiple cutting functions into a single blade structure. The blade includes both a first cutting edge for initial cutting and a second cutting edge for finishing cuts, allowing both roughing and finishing operations to be performed in one continuous process rather than requiring separate step cutting operations.
Solution Approach 2:
The blade is designed with multi-functionality by incorporating different cutting edges with varying characteristics. The first cutting edge has different properties than the second cutting edge, enabling the same blade to perform multiple cutting stages (rough cutting and finishing cutting) without requiring blade changes or multiple specialized blades.
3Manufacturing precision
If multiple blades are used for stepwise cutting, then the substrate can be fully cut with desired side surfaces, but the device complexity and process complexity are increased
Solution Approach 1:
The patent combines multiple cutting functions into a single blade structure. The blade includes both a first cutting edge for initial cutting and a second cutting edge for finishing cuts, allowing both roughing and finishing operations to be performed in one continuous process rather than requiring separate step cutting operations.
Solution Approach 2:
The blade is designed with multi-functionality by incorporating different cutting edges with varying characteristics. The first cutting edge has different properties than the second cutting edge, enabling the same blade to perform multiple cutting stages (rough cutting and finishing cutting) without requiring blade changes or multiple specialized blades.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively divides substrates into individual chips while forming desired side surfaces, reducing processing time and improving productivity by using a single operation with a profile grinding tool that includes abrasive grain layers for precise cutting and surface grinding.
Implementation Method 1
a shaped abrasive member having a projection for cutting the substrate, the projection having an inclined side surface or a vertical side surface with a step portion
Implementation Method 2
the abrasive grain layer formed on the outer circumferential surface of the cylindrical base comes into contact with the upper surface of each chip to thereby grind the upper surface of each chip
Data Source
AI summary
There is provided a processing method for a package substrate having a plurality of division lines formed on the front side. The processing method includes the steps of holding the back side of the package substrate by using a holding tape and fully cutting the package substrate along the division lines to such a depth corresponding to the middle of the thickness of the holding tape by using a profile grinding tool, thereby dividing the package substrate into individual semiconductor packages. The profile grinding tool has a plurality of projections for cutting the package substrate respectively along the plural division lines. Each projection has an inclined side surface.