Shaped Semiconductor Die for Shared Die Attach Pad Footprints
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Solution Overview
Problem
The challenge of accommodating semiconductor dies with varying dimensions in semiconductor devices complicates fabrication and increases inventory complexity, as different interconnects are required for dies with smaller and larger footprints, hindering interconnect sharing and increasing manufacturing costs.
Innovation Solution
The dies are shaped to have a smaller base surface that fits within the dimensions of a smaller die attach pad, with a larger top surface, allowing them to be mounted using a single interconnect, and are encapsulated with a molding compound to form a semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dies with varying dimensions are accommodated using different interconnects, then each die can be properly mounted, but inventory complexity and device complexity increase
Solution Approach 1:
The patent applies universality by designing a single interconnect structure that can accommodate dies of varying dimensions. The interconnect includes a die attach pad with a surface region that can receive base surfaces of different sized dies, making one interconnect design serve multiple die size requirements rather than requiring separate interconnect variants for each die dimension.
Solution Approach 2:
The patent applies local quality by etching voids at specific locations on the die to create an overhanging structure. This local modification creates a base surface with reduced footprint that fits within the standardized die attach pad, while the rest of the die (top surface) maintains its original larger dimensions for functional purposes.
2Adaptability or versatility
If dies with varying dimensions are accommodated using different interconnects, then proper mounting is achieved, but manufacturing cost increases
Solution Approach 1:
By creating a universal die attach pad design that accommodates multiple die sizes, the patent eliminates the need to manufacture and maintain multiple interconnect variants in inventory. This single-design approach reduces manufacturing complexity, simplifies supply chain management, and lowers overall production costs while maintaining the ability to mount various die dimensions.
Solution Approach 2:
The patent effectively discards the approach of maintaining multiple interconnect designs and recovers resources by standardizing on a single interconnect design. The void etching process removes minimal material to create the overhanging structure, while the discarded idea of multiple interconnect variants is replaced by one versatile design.
3Adaptability or versatility
If dies with varying dimensions are accommodated using different interconnects, then proper mounting is achieved, but fabrication complexity increases
Solution Approach 1:
The patent simplifies fabrication by applying local quality - etching voids only at specific locations on the die to create the overhanging base surface. This localized modification is simpler than managing multiple interconnect fabrication processes, as it requires only a single etching step on the die itself rather than maintaining separate fabrication lines for different interconnect types.
Solution Approach 2:
The universal die attach pad design reduces fabrication complexity by eliminating the need to produce and manage multiple interconnect variants. The single standardized design simplifies the fabrication workflow, reduces quality control variations across different interconnect types, and streamlines the overall manufacturing process.
Data Source
AI summary
The first example is related to a device including a die attach pad and a die. The die attach pad has a surface region. The die includes a base surface that fits within the surface region of the die attach pad. The die also includes a top surface opposite the base surface. The top surface is larger than the base surface.