Shaped Electrode MEMS Microphone Noise Reduction
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Solution Overview
Problem
Smaller microphones in devices face higher acoustic noise and lower signal-to-noise ratios due to increased acoustic and thermal losses, which are not effectively addressed by conventional designs.
Innovation Solution
The electrode in capacitive microphone assemblies is positioned away from the region of maximum diaphragm deflection, reducing maximum diaphragm deflection without significantly impacting sensitivity, and incorporating openings in the electrode to increase the gap between the back plate and diaphragm, thereby reducing squeeze film damping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the microphone size is reduced to fit smaller devices, then the device compactness is improved, but the acoustic noise increases and signal-to-noise ratio deteriorates due to higher acoustic and thermal losses
Solution Approach 1:
The electrode is positioned at a specific location on the back plate that corresponds to a region of relatively lower diaphragm deflection, rather than uniformly across the entire back plate. This localized positioning creates a region of interest with different mechanical properties (lower deflection) that reduces acoustic noise while maintaining sensitivity in other regions
Solution Approach 2:
The electrode positioning is designed in advance to anticipate and prevent the problem of acoustic noise. By pre-positioning the electrode in a region of lower deflection, the design proactively reduces acoustic noise before it becomes a performance limitation, rather than attempting to correct it after the fact
2Measurement precision
If the electrode is positioned at the center of the diaphragm to maximize sensitivity, then the signal-to-noise ratio is improved, but the maximum diaphragm deflection increases causing higher acoustic noise
Solution Approach 1:
The back plate is designed with regions of different deflection characteristics. The electrode is positioned in a localized region of lower deflection, while other regions of the diaphragm maintain their natural deflection patterns. This creates spatial variation in mechanical properties that simultaneously reduces noise and preserves sensitivity
Solution Approach 2:
The back plate and diaphragm system is effectively segmented into different functional zones: a central region with the electrode experiencing lower deflection (noise reduction zone) and surrounding regions that maintain higher deflection for sensitivity. This segmentation allows independent optimization of different performance aspects
3Measurement precision
If the gap between the back plate and diaphragm is reduced to improve sensitivity, then the acoustic sensitivity increases, but the squeeze film damping increases causing higher acoustic noise
Solution Approach 1:
The electrode positioning creates a localized measurement zone with optimized gap characteristics. By positioning the electrode in a region of lower deflection, the effective gap varies spatially, reducing squeeze film damping in the electrode region while maintaining sensitivity through the capacitive coupling mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the signal-to-noise ratio and acoustic sensitivity while minimizing noise, allowing for improved performance in compact microphone designs.
Implementation Method 1
The back plate and the diaphragm each include an electrode, which are used to convert the acoustic energy into an electrical signal
Implementation Method 2
the diaphragm, which moves relative to the back plate in response to acoustic energy (e.g., pressure fluctuations)
Implementation Method 3
incorporating openings in the electrode to increase the gap between the back plate and diaphragm, thereby reducing squeeze film damping
Data Source
AI summary
A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.


