Shaped Guide Surfaces for Uniform Polishing Tape Contact
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Solution Overview
Problem
Conventional polishing methods using abrasive tapes often result in scratches and uneven polishing of semiconductor wafers due to tape deformation, leading to inefficient and time-consuming processes, especially when polishing curved surfaces or notches.
Innovation Solution
A polishing apparatus and method that employs a polishing tape guided by shaped guide surfaces to match the substrate's geometry, ensuring uniform contact and movement relative to the substrate for high-speed polishing without scratches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the polishing tape is thinned to match the notch portion shape, then the polishing uniformity is improved, but the resistance to tension is reduced
Solution Approach 1:
The polishing tape is designed as a flexible thin film that can be deformed to match the notch portion shape during polishing, while maintaining sufficient tensile strength through proper material selection and thickness optimization. The tape's flexibility allows it to conform to curved surfaces without breaking or detaching.
2Manufacturing precision
If the polishing tape is deformed to match the notch portion shape, then the polishing uniformity is improved, but the edge portions may scratch the substrate
Solution Approach 1:
The polishing tape is designed with non-uniform thickness, having a thinner central portion that matches the notch shape and thicker edge portions that prevent scratching. This local quality variation allows the tape to conform to the substrate geometry while maintaining structural integrity and preventing edge damage.
3Stability of the object's composition
If the polishing tape area contacting the wafer is reduced, then the deformation is reduced, but the polishing stability is reduced
Solution Approach 1:
The polishing system employs dynamic control of the polishing tape tension and positioning, allowing the tape to be deformed to match the substrate shape while maintaining stable contact through real-time adjustment of applied forces and tape feed rate.
4Area of stationary object
If the polishing tape is deformed to match the substrate shape, then the contact area is increased, but the polishing time is increased
Solution Approach 1:
The polishing process maintains continuous contact between the polishing tape and the substrate surface through proper tape feeding and deformation control, ensuring that the entire contact area is utilized effectively throughout the polishing operation without interruptions or repositioning delays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables uniform and high-speed polishing of semiconductor wafers by ensuring the polishing tape conforms to the substrate's shape, reducing the likelihood of scratches and improving the efficiency of the polishing process.
Implementation Method 1
At least one of the guide surface of the first guide portion and the guide surface of the second guide portion has a shape corresponding to a shape of the portion of the substrate to be polished
Data Source
AI summary
A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).