Shaped Integrated Passive Devices with Plated V-Grooves
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Solution Overview
Problem
Current technologies for mounting electronic components on printed circuit boards face challenges in achieving high-density, miniaturization, and efficient electrical connection while occupying minimal space, with existing designs failing to encompass all desired characteristics for passive devices.
Innovation Solution
The development of shaped integrated passive devices with conductive plating on silicon wafers, featuring V-grooves that serve as both mounting and grounding/power connection points, allowing for simplified attachment and improved electrical coupling to circuit boards using conductive epoxy and wire bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional mounting techniques are used for passive devices, then mechanical connection is achieved, but electrical connection requires multiple wire bonds increasing device complexity and space occupation
Solution Approach 1:
The patent merges mechanical mounting and electrical connection functions into a single integrated structure. The V-groove configuration with conductive plating allows the passive device to be mechanically mounted and electrically connected simultaneously, eliminating the need for separate wire bonds and reducing overall device complexity
Solution Approach 2:
The V-groove structure serves multiple functions: it provides mechanical support for mounting, creates electrical connection paths through conductive plating, and enables both grounding and power connections. This multi-functionality reduces the number of separate components and connection elements needed
2Area of stationary object
If miniaturization is pursued for passive devices, then space occupation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The V-grooves are formed and conductive plating is applied to the silicon wafer before dicing into individual devices. This preliminary action ensures that the critical dimensional tolerances are established when the entire wafer can be processed uniformly, reducing the precision requirements for individual miniaturized devices
3Reliability
If multiple wire bonds are used for electrical connection, then reliable electrical connection is achieved, but inductance and resistance variations increase
Solution Approach 1:
The patent extracts the electrical connection function from separate wire bonds and integrates it into the mounting structure itself. The conductive plating on the V-groove surfaces provides direct electrical pathways, eliminating the harmful inductance and resistance variations introduced by multiple wire bond connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient mechanical and electrical connections, reducing the need for multiple wire bonds, minimizing inductance and resistance variations, and enhancing high-frequency performance by providing a compact, reliable mounting and connection system for passive and active components.
Implementation Method 1
shaped, plated side filter devices wherein the plated sides provide both mounting and grounding/power coupling functions
Implementation Method 2
simplified attachment and improved electrical coupling to circuit boards using conductive epoxy and wire bonds
Data Source
AI summary
Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing simplified mounting on and simultaneous connection to selected electrical pathways on a printed circuit board or other mounting substrate. Shaped, plated side filter devices have plated sides which provide both mounting and grounding/power coupling functions. Thin film filters may be constructed on silicon wafers, which are then diced from the top surface with an angular dicing saw to produce a shaped groove in the top surface. The groove may be v-shaped or other shape, and is then plated with a conductive material. Individual pieces are separated by grinding the back surface of the wafer down to where the grooves are intercepted. The plated grooves serve as ground or power connection points for the filter circuit. The metallized slopes of the plated grooves are used in securing the individual pieces to a mounting surface, by soldering or using conductive epoxy.