Package Power Delivery Using Shaped Vias and Thick Planes
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing the overall thickness and increasing routing density due to the need for reduced copper line widths and spacings, which increases path resistance in power delivery networks, while also requiring thicker metal for power planes, leading to increased package thickness and cost.
Innovation Solution
The solution involves decoupling the thickness of signal lines and power planes within a single routing layer by using lithographic patterning to form vias and power planes concurrently, allowing for thinner signal lines and thicker power planes without additional processing steps, thereby optimizing both parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If copper line widths and spacing are reduced to decrease package thickness, then package thickness is reduced, but path resistance increases
Solution Approach 1:
The patent applies local quality by forming signal lines and power planes with different metal thicknesses within the same routing layer. Signal lines are formed with a first metal thickness optimized for routing density, while power planes are formed with a second metal thickness (greater than the first) optimized for low path resistance. This localized differentiation resolves the contradiction by allowing thin signal lines for reduced package thickness while maintaining thick power planes for low resistance.
2Reliability
If power plane thickness is increased to reduce path resistance, then path resistance is reduced, but signal routing line widths and spacings must be increased
Solution Approach 1:
The patent uses local quality to differentiate metal thickness within the same routing layer. Power planes are formed with increased thickness to reduce path resistance, while signal routing lines maintain thinner thickness to preserve fine line and space design rules. This allows high routing density to be maintained despite thicker power planes, as each feature type optimizes its own thickness independently.
Solution Approach 2:
The patent segments the metal deposition process into separate steps for signal lines and power planes. First, signal lines are formed with a first metal thickness, then power planes are formed with a second, greater metal thickness in the same routing layer. This segmentation allows independent optimization of thickness for each feature type, resolving the contradiction between power plane thickness and routing density.
3Productivity
If signal line thickness is reduced to increase routing density, then routing density is increased, but path resistance increases
Solution Approach 1:
The patent applies local quality by forming signal lines with a first metal thickness that enables fine line and space design rules for high routing density, while simultaneously forming power planes with a second, greater metal thickness that provides low path resistance. This localized thickness differentiation allows routing density to be maximized without compromising power delivery performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces path resistance in power planes while maintaining fine line and space design rules for signal lines, increasing routing density and reducing package thickness and cost.
Implementation Method 1
using lithographic patterning to form vias and power planes concurrently
Data Source
AI summary
Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, the electrical package may include a first package layer. A plurality of signal lines with a first thickness may be formed on the first package layer. Additionally, a power plane with a second thickness may be formed on the first package layer. According to an embodiment, the second thickness is greater than the first thickness. Embodiments of the invention may form the power plane with a lithographic patterning and deposition process that is different than the lithographic patterning and deposition process used to form the plurality of signal lines. In an embodiment, the power plane may be formed concurrently with vias that electrically couple the signal lines to the next routing layer.