Shared Barrier Layer RDL and Via Structure for Multi-Die Packaging

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Solution Overview

Problem

As integrated circuit packages become increasingly complex, with multiple device dies packaged together to achieve more functions, there is a need for efficient methods to connect and bond these dies while maintaining optimal performance and reducing manufacturing costs.

Innovation Solution

The solution involves a method of manufacturing a package structure that includes bonding multiple dies together using hybrid bonding techniques, forming through dielectric vias and redistribution layers to facilitate electrical connections, and using dielectric and conductive materials to create a robust and efficient interconnect system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple device dies are packaged together to achieve more functions, then device functionality and performance are improved, but package complexity increases

Engineering Contradiction:

Improvedevice functionalityVSAvoidpackage complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The package structure is divided into multiple device dies (first device die, second device die) that can be independently manufactured and then bonded together. Each die can be optimized for specific functions, allowing complex functionality to be achieved through modular assembly rather than a single complex chip.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple device dies are nested within a single package structure, with each die containing its own internal architecture while being integrated into the larger system. The through dielectric via and redistribution layer structure allows nested interconnection between different die levels.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If hybrid bonding techniques are used to bond multiple dies, then connectivity and performance are improved, but manufacturing process complexity increases

Engineering Contradiction:

ImproveconnectivityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The barrier layer is formed on the through dielectric via before the conductive layer is deposited, preparing the surface in advance for optimal adhesion and electrical properties. This preliminary barrier layer formation simplifies the overall manufacturing process by preventing defects that would require rework.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The through dielectric via structure serves multiple functions: it provides mechanical support, electrical connection, and a platform for the barrier and conductive layers. This multi-functional design reduces the need for separate structures, simplifying the manufacturing process while maintaining high connectivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If through dielectric vias and redistribution layers are formed, then electrical connection efficiency is improved, but manufacturing steps increase

Engineering Contradiction:

Improveelectrical connection efficiencyVSAvoidmanufacturing steps

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The formation of the through dielectric via, barrier layer, and conductive layer is combined into a single integrated structure. The via penetrates through the dielectric substrate and is immediately followed by conformal barrier and conductive layer deposition, creating a unified interconnection element that reduces the number of separate manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The barrier layer acts as an intermediary between the dielectric via and the conductive layer, providing a transition interface that ensures proper adhesion and electrical properties. This intermediary layer enables the efficient formation of the complete interconnection structure in a streamlined process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12211823B2Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same

Publication Date: 2025.01.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die electrically bonded to the first die includes a through substrate via. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The dielectric layer is disposed on the second die and the insulation structure. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via. The redistribution layer includes a first barrier layer and a conductive layer on the first barrier layer. The through substrate via is electrically connected to the redistribution layer, and the conductive layer is in contact with a conductive post of the through via and separated from the through substrate via by the first barrier layer therebetween.