Shared Barrier Redistribution Via Structure for Multi-Die Packaging
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Solution Overview
Problem
As integrated circuit packages become increasingly complex, with multiple device dies packaged together to achieve more functions, there is a need for efficient methods to connect and bond these dies while maintaining optimal performance and reducing manufacturing costs.
Innovation Solution
The solution involves a method of manufacturing a package structure that includes bonding multiple device dies using hybrid bonding techniques, forming through dielectric vias and redistribution layers to facilitate electrical connections, and using dielectric and conductive materials to create a robust and efficient interconnect system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies are packaged together to achieve more functions, then device functionality and performance are improved, but package complexity and manufacturing difficulty increase
Solution Approach 1:
The package structure is divided into multiple device dies (first device die, second device die) that can be independently manufactured and then bonded together. Each die can be optimized for specific functions, allowing complex functionality to be achieved through modular assembly rather than a single complex chip.
Solution Approach 2:
Multiple device dies are nested within a single package structure, with each die containing its own internal structures and being bonded to others through hybrid bonding interfaces. This nesting allows multiple functional units to coexist in a compact arrangement.
2Reliability
If hybrid bonding techniques are used to connect multiple device dies, then connectivity and electrical performance are improved, but manufacturing precision requirements increase
Solution Approach 1:
The hybrid bonding interface incorporates different material layers (copper pillars, tungsten plugs, dielectric materials) with specific local properties optimized for their functions. Copper provides electrical conductivity, tungsten provides mechanical strength, and dielectric materials provide insulation, allowing each region of the bonding interface to have tailored properties that facilitate reliable connection.
Solution Approach 2:
The bonding structure uses composite materials including copper-tungsten combinations, dielectric layers, and conductive interconnects. This composite approach allows the bonding interface to simultaneously achieve electrical conductivity, mechanical strength, and thermal management, reducing the precision burden on any single material layer.
3Reliability
If through dielectric vias and redistribution layers are formed to facilitate electrical connections, then electrical connectivity is improved, but manufacturing process complexity increases
Solution Approach 1:
Through dielectric vias and redistribution layers are formed as part of the preliminary manufacturing process before final die bonding. This preliminary formation of conductive pathways and electrical interconnects ensures that electrical connectivity is established early in the manufacturing process, simplifying subsequent assembly steps.
Solution Approach 2:
Electrical connections are established not only through planar bonding interfaces but also through vertical through-dielectric vias that penetrate through dielectric layers. This three-dimensional interconnect approach allows electrical pathways to be routed through multiple layers and dimensions, providing flexible connectivity options.
Data Source
AI summary
A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die is electrically bonded to the first die and includes a through substrate via. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via, and the redistribution layer includes a barrier layer and a conductive layer. The conductive layer of the redistribution layer continuously extends between opposite surfaces of the dielectric layer, and a conductive post of the through via extends from the surface of the dielectric layer towards the first die, and the conductive layer of the redistribution layer is separated from the through substrate via by the barrier layer.