Shared Base Plate with Discrimination Terminal for Semiconductor Modules
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Solution Overview
Problem
Conventional semiconductor module manufacturing involves increasing component types and costs due to the need for different base plates for various circuit and component configurations, leading to inefficiencies in production.
Innovation Solution
A shared base plate design that can accommodate multiple semiconductor module types with different circuit and component configurations, featuring a base portion for mounting electronic components and a terminal formed portion with discrimination terminals, allowing for standardized components and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different base plates are designed for different circuit configurations and component arrangements, then the semiconductor modules can be customized for specific applications, but the number of component types increases and manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing a single standardized base plate that can accommodate multiple circuit configurations and component arrangements. The base plate includes a standardized mounting area, terminal formed portion, and discrimination terminal that work across different semiconductor module types, eliminating the need for multiple specialized base plate designs while maintaining application-specific customization capabilities
Solution Approach 2:
The patent applies segmentation by dividing the base plate into distinct functional regions: a mounting area for electronic components, a terminal formed portion for electrical connections, and a discrimination terminal for identification. This segmentation allows the same base plate structure to support different component configurations through selective component placement rather than requiring different base plate designs
2Adaptability or versatility
If different base plates are designed for different circuit configurations and component arrangements, then the semiconductor modules can be customized for specific applications, but the manufacturing cost increases
Solution Approach 1:
The standardized base plate design enables universal manufacturing processes across all semiconductor module types. By using the same base plate structure, the patent eliminates the need for multiple specialized manufacturing lines, tooling sets, and quality control procedures, thereby reducing overall manufacturing costs while maintaining the ability to produce different module configurations
Solution Approach 2:
The patent merges multiple base plate designs into a single standardized base plate that serves all circuit configurations and component arrangements. This consolidation reduces material procurement costs, simplifies inventory management, and enables economies of scale in production, directly addressing the manufacturing cost increase issue
3Device complexity
If a shared base plate is used for multiple semiconductor module types, then the number of component types is reduced and manufacturing cost is reduced, but discrimination between different module types is required
Solution Approach 1:
The patent applies visual discrimination through the discrimination terminal feature on the standardized base plate. Different terminal configurations, positions, or markings on the discrimination terminal provide easily distinguishable identifiers for different semiconductor module types, enabling operators to quickly identify and handle the correct module type without confusion
Data Source
AI summary
A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.