Shared Bus Memory Architecture for Multi-Chip Data Transfer

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Solution Overview

Problem

Conventional memory systems face inefficiencies in data transmission and increased power consumption due to each memory being coupled to multiple chips on a one-to-one basis, requiring additional memory for data transmission and lacking a shared channel for direct memory-to-memory data transfer.

Innovation Solution

A memory system with a stacked memory device that allows multiple chips to share a single memory through a shared bus, enabling direct data transmission between chips without accessing the memory core, thereby increasing data transmission efficiency and reducing power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If each memory is coupled to multiple chips on a one-to-one basis, then each chip can access its dedicated memory, but additional memory is required for data transmission between chips and power consumption increases

Engineering Contradiction:
Improvedata access reliabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

Multiple chips share a single memory device through a shared bus, merging what were previously separate one-to-one connections into a many-to-one shared resource configuration, eliminating redundant memory instances and reducing overall power consumption

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared memory device serves multiple chips simultaneously, making the memory resource universal and multi-functional rather than dedicated to a single chip, thereby reducing the total number of memory devices needed in the system

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If each memory is coupled to multiple chips on a one-to-one basis, then data access is straightforward, but data transmission between memories requires additional memory and increases power consumption

Engineering Contradiction:
Improvedata access simplicityVSAvoidpower consumption for data transmission
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

Multiple chips share a single memory device through a shared bus, merging what were previously separate one-to-one connections into a many-to-one shared resource configuration, eliminating redundant memory instances and reducing overall power consumption

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared bus acts as an intermediary communication channel that enables direct data transmission between chips sharing the same memory, eliminating the need for additional memory devices to facilitate data transfer between chips

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If a shared bus is used for multiple chips to access a single memory, then power consumption is reduced and bandwidth increases, but access coordination becomes more complex

Engineering Contradiction:
ImprovebandwidthVSAvoidaccess coordination complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The memory system dynamically allocates access rights to the shared bus based on current operational needs, with the controller adapting bus access permissions in real-time to optimize bandwidth utilization while managing access coordination complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The controller monitors bus usage and memory access patterns, using feedback mechanisms to dynamically adjust access coordination strategies, ensuring optimal bandwidth utilization while managing the complexity of shared resource access

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS10762012B2Memory system for sharing a plurality of memories through a shared channel
Publication Date: 2020.09.01 SK HYNIX INC
  • US10762012B2 patent drawing
  • US10762012B2 patent drawing
  • US10762012B2 patent drawing

AI summary

A memory system memory system includes a first chip configured to perform a first operation, a second chip configured to perform a second operation, and a stacked memory device including a stacked structure of a plurality of memories. The stacked memory device being configured to be accessed by the first chip and the second chip through a shared bus.