Shared Cooling Assembly for Multi-Compartment Power Routing
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Solution Overview
Problem
Existing thermal transfer structures in electrical power equipment, such as heatsinks and coolant systems, occupy significant space and face form factor constraints in confined enclosures, making efficient heat management challenging for heat-generating semiconductor devices.
Innovation Solution
A power routing apparatus with a cooling structure featuring a coolant passage between compartments, heatsinks, and a fan system that generates coolant flow parallel to opposing walls, allowing for efficient thermal coupling and space optimization by sharing cooling resources between semiconductor switches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heatsinks and coolant systems are used for thermal management, then heat transfer effectiveness is improved, but space occupation increases significantly
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated cooling structure that serves multiple semiconductor devices simultaneously. The cooling structure includes a common coolant passage and multiple heatsink assemblies that can cool different devices through shared coolant flow, thereby reducing the total volume required compared to separate cooling systems for each device.
Solution Approach 2:
The cooling structure is designed with universal applicability to multiple semiconductor devices. The coolant passage and heatsink assemblies can serve different power semiconductor devices (such as IGBTs, MOSFETs, or diodes) within the same enclosure, allowing one cooling system to perform multiple cooling functions rather than requiring dedicated cooling systems for each device.
2Temperature
If thermal transfer structures are provided within confined enclosures, then heat dissipation is improved, but form factor constraints increase
Solution Approach 1:
The cooling structure is segmented into multiple functional zones including coolant intake passages, multiple heatsink assemblies with separate heat transfer surfaces for different devices, and exhaust passages. This segmentation allows each zone to be optimized for its specific function while maintaining overall compactness, addressing form factor constraints through modular design.
Solution Approach 2:
The patent utilizes three-dimensional space efficiently by arranging heatsink assemblies and coolant passages in multiple dimensions within the enclosure. The cooling structure extends in vertical, horizontal, and depth directions, utilizing available space more effectively rather than simply expanding in one direction, thereby reducing form factor constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient and space-effective thermal management system that effectively cools semiconductor devices, optimizing space usage and preventing device degradation by directing coolant flow and heat transfer within the enclosure.
Implementation Method 1
the first and second semiconductor switches thermally coupled to the at least one heatsink
Implementation Method 2
the at least one heat transfer surface receives the coolant flow from the at least one fan
Implementation Method 3
at least one fan disposed between the first and second walls and configured to generate the coolant flow
Data Source
AI summary
An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.