Multi-Component Shared Cooling System for IHS Thermal Management

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Solution Overview

Problem

Existing information handling systems (IHS) face inefficiencies in cooling multiple heat-producing components, leading to increased weight, cost, and reduced thermal power due to separate cooling systems, which can result in reduced cooling capacity when volume is limited and fans are used.

Innovation Solution

A shared cooling system utilizing a first and second heat exchanger device thermally connected to multiple components, allowing heat dissipation without the need for separate fans, by using heat pipes or direct thermal connections to distribute thermal loads across components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate cooling systems are used for multiple heat-producing components, then each component can be cooled independently, but system weight and cost increase and supported thermal power decreases

Engineering Contradiction:

Improveindependent cooling capabilityVSAvoidsystem weight

Core Design Contradiction:

ReliabilityVSWeight of stationary object

Solution Approach 1:

The patent combines multiple separate cooling systems into a single shared cooling system with one fan that serves multiple heat-producing components. The heat sinks are positioned to be serviced by a common airflow path, eliminating redundant fans and reducing overall system weight while maintaining independent cooling capability through thermal connection architecture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single fan in the shared cooling system performs multiple functions by providing airflow to multiple different heat sinks through strategic positioning and thermal connections. This multi-functional design eliminates the need for separate dedicated fans for each component, reducing weight and cost while maintaining effective cooling for all components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If separate cooling systems are used for multiple heat-producing components, then each component can be cooled independently, but cost increases

Engineering Contradiction:

Improveindependent cooling capabilityVSAvoidsystem cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple cooling systems into one shared system, reducing the total number of components that need to be manufactured, assembled, and maintained. This consolidation directly reduces manufacturing cost and complexity while preserving the ability to cool multiple components independently through the thermal connection architecture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The universal fan design serves multiple heat sinks through a common airflow path, reducing the bill of materials and assembly complexity. This multi-functional approach lowers manufacturing cost by eliminating redundant components while maintaining effective cooling for all connected components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If heat sinks are stacked to save volume, then volume utilization improves, but one heat sink receives heated airflow reducing cooling capacity

Engineering Contradiction:

Improvevolume utilizationVSAvoidcooling capacity

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent applies local quality by strategically positioning heat sinks at different locations within the chassis and creating distinct airflow paths for each heat sink through the shared cooling system. This ensures that each heat sink receives relatively cool airflow while maintaining compact volume utilization, preventing the scenario where one heat sink receives heated airflow from another.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces component operating temperatures, acoustic noise, and extends intensive processing periods by effectively sharing thermal loads and distributing heat across components, improving cooling efficiency and reducing chassis skin temperatures.

Implementation Method 1

heat produced by the processor is transmitted from the processor and to the heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the operation of the fan produces airflow through the heat sink that allows for heat produced by the processor to be continuously drawn away from the processor

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS9459669B2Multi-component shared cooling system

Publication Date: 2016.10.04 DELL PROD LP

AI summary

Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is housed in the chassis, includes a first thermal connection to the first heat exchanger device, and includes a second thermal connection to the second heat exchanger device. A second component such as, for example, a graphics processor, is housed in the chassis and includes a third thermal connection to the first heat exchanger device. The first heat exchanger device is configured to dissipate heat that is produced by the second component and transmitted by the third thermal connection. The second heat exchanger device is configured to dissipate the heat that is produced by the second component and transmitted by the third thermal connection, the first heat exchanger device, the first thermal connection, the first component, and the second thermal connection.