Shared Light-Emitting Layer Micro-LED Structure for Edge Carrier Loss
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Solution Overview
Problem
Current micro-LED structures face inefficiencies due to surface recombination carrier loss at the edges of the light emitting layer, which affects light emission efficiency, particularly when the light emitting layer edges contact the conductive layers.
Innovation Solution
A micro-LED structure design where the light emitting layer extends horizontally away from the edges of the conductive layers, ensuring no contact and minimizing surface recombination, with additional features like spacers and isolation structures to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light emitting layer contacts the conductive layers at the edges, then the device structure is simplified, but surface recombination carrier loss increases and light emission efficiency decreases
Solution Approach 1:
The patent introduces an isolation layer as an intermediary component between the light emitting layer and the conductive layers. This isolation layer prevents direct contact at the edges, thereby eliminating surface recombination carrier loss while maintaining structural organization. The isolation layer acts as a mediator that resolves the conflict between structural simplicity and energy efficiency.
2Ease of manufacture
If the light emitting layer contacts the conductive layers, then manufacturing is easier, but light emission efficiency deteriorates
Solution Approach 1:
The isolation layer serves as a manufacturable intermediary component that can be integrated into the existing fabrication process. While it adds a layer to the structure, it uses standard semiconductor materials and deposition techniques, making it compatible with current manufacturing capabilities. The isolation layer prevents edge contact that causes carrier loss, thereby improving light emission efficiency without requiring fundamentally new manufacturing approaches.
3Use of energy by moving object
If the light emitting layer extends horizontally away from the conductive layer edges, then surface recombination is minimized and light emission efficiency improves, but device complexity increases
Solution Approach 1:
The isolation layer provides a straightforward structural solution that separates the light emitting layer from the conductive layers at the edges. This separation enables the light emitting layer to extend horizontally without direct contact, minimizing surface recombination. The isolation layer's simple planar structure adds minimal complexity while effectively achieving the desired spatial separation.
4Use of energy by moving object
If the light emitting layer extends horizontally away from the conductive layer edges, then carrier injection is optimized, but manufacturing precision requirements increase
Solution Approach 1:
The isolation layer acts as a precision-defined intermediary structure that establishes clear boundaries between the light emitting layer and conductive layers. By providing a well-defined isolation region, it guides the horizontal extension of the light emitting layer with precise alignment. The isolation layer's structured design enables controlled carrier injection while maintaining manufacturable precision requirements through standard lithography and deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light emission efficiency by preventing surface recombination and optimizing carrier injection, leading to enhanced performance and reliability of the micro-LEDs.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. A profile of the first type conductive layer perpendicularly projected on a bottom surface of the second type conductive layer is surrounded by an edge of the second type conductive layer.