Shared Epitaxial Micro-LED Layout for Edge Recombination Control
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Solution Overview
Problem
Existing micro-LED structures face challenges in enhancing light emission efficiency due to surface recombination carrier loss at the edges of the light emitting layer contacting the conductive layers.
Innovation Solution
A micro-LED structure is designed with a light emitting layer that extends horizontally away from the edges of the first and second conductive layers, preventing edge contact and reducing surface recombination, while also incorporating a metal layer on the light emitting layer between adjacent micro-LEDs for improved isolation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting layer contacts the conductive layers at the edges, then the device structure is simplified and easier to manufacture, but surface recombination occurs causing loss of light emission efficiency
Solution Approach 1:
The patent extracts the harmful edge contact between the light emitting layer and conductive layers by introducing an isolation structure that separates these layers at the edges, thereby removing the source of surface recombination loss while maintaining the overall device structure
Solution Approach 2:
The patent introduces an intermediary isolation structure (such as an isolation layer or isolation groove) between the light emitting layer and conductive layers at the edges, which prevents direct contact and eliminates surface recombination without complicating the manufacturing process
2Loss of energy
If the light emitting layer extends horizontally away from the conductive layers, then surface recombination is reduced and light emission efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The patent resolves the structural complexity issue by extending the light emitting layer in the horizontal dimension away from the conductive layers, creating a lateral separation that reduces surface recombination without requiring additional vertical layers or complex three-dimensional structures
3Productivity
If adjacent micro-LEDs are placed close together, then the chip area is reduced and productivity increases, but isolation between adjacent micro-LEDs becomes insufficient leading to performance degradation
Solution Approach 1:
The patent applies segmentation by dividing the chip into multiple independent micro-LED units with isolation structures between them, allowing close placement for high density while maintaining electrical and optical isolation to prevent performance degradation from adjacent devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emission efficiency by minimizing surface recombination and improving carrier injection efficiency, while the metal layer aids in isolating adjacent micro-LEDs, leading to improved performance and reliability.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer.