Shared Envelope Tracking Circuit for Multi-PA Beamforming
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Solution Overview
Problem
Mobile communication devices face increased power consumption and thermal dissipation when employing multiple power amplifiers for mmWave RF signals, leading to complexity and heat issues, particularly when supporting RF beamforming without an excessive number of envelope tracking (ET) circuits.
Innovation Solution
An ET power amplifier apparatus with a single ET circuit that generates modulated voltages adapted to the power levels and impedances of multiple RF signals, comprising a target voltage circuit, a supply voltage circuit, and an ET voltage circuit, which reduces the footprint and improves heat dissipation by providing ET modulated voltages to multiple amplifier circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple ET circuits are employed to support multiple power amplifiers for RF beamforming, then the power amplifier efficiency and linearity are improved, but the device footprint and complexity increase
Solution Approach 1:
The patent combines multiple ET circuits into a single integrated ET circuit that serves multiple power amplifiers. The single ET circuit includes multiple voltage output channels that can simultaneously provide envelope tracking voltages to multiple PAs, thereby reducing the overall number of ET circuits needed while maintaining the efficiency and linearity benefits for RF beamforming operations
Solution Approach 2:
The single ET circuit is designed with multi-functional capability to serve multiple power amplifiers simultaneously. It includes a voltage generation unit that can produce multiple independent envelope tracking voltages with different amplitude and phase characteristics, allowing one circuit to perform the function previously requiring multiple separate circuits
2Use of energy by moving object
If multiple ET circuits are used for simultaneous RF beamforming, then the power consumption efficiency is improved, but the heat dissipation increases
Solution Approach 1:
By merging multiple ET circuits into a single integrated circuit, the patent reduces the total number of active components and interconnections, which directly reduces power consumption and consequently heat dissipation. The single ET circuit shares common functional blocks (such as voltage generation and control logic) among multiple output channels, eliminating redundant power consumption that would occur in multiple separate circuits
Solution Approach 2:
The multi-functional ET circuit performs the work of multiple circuits using shared resources and common processing units, thereby reducing overall power consumption and heat generation while still providing efficient power management for multiple power amplifiers during RF beamforming operations
3Productivity
If multiple power amplifiers are employed for mmWave RF signals, then the data rate and wireless communication performance are improved, but the power consumption and thermal dissipation increase
Solution Approach 1:
The ET circuit incorporates feedback mechanisms that continuously monitor the output power levels of multiple power amplifiers and dynamically adjust the envelope tracking voltages accordingly. This feedback control ensures that each PA operates at optimal efficiency points, maximizing data rate performance while minimizing overall power consumption and thermal dissipation across the multi-PA system
Data Source
AI summary
An envelope tracking (ET) circuit and related power amplifier apparatus is provided. An ET power amplifier apparatus includes an ET circuit and a number of amplifier circuits. The ET circuit is configured to provide a number of ET modulated voltages to the amplifier circuits for amplifying concurrently a number of radio frequency (RF) signals. The ET circuit includes a target voltage circuit for generating a number of ET target voltages adapted to respective power levels of the RF signals and/or respective impedances seen by the amplifier circuits, a supply voltage circuit for generating a number of constant voltages, and an ET voltage circuit for generating the ET modulated voltages based on the ET target voltages and a selected one of the constant voltages. By employing a single ET circuit, it may be possible to reduce the footprint and improve heat dissipation of the ET power amplifier apparatus.