Shared Fan Array Cooling for Fan-Less Computing Devices

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Solution Overview

Problem

Data centers housing blockchain miners and other compute-intensive workloads face significant cooling challenges due to high heat generation and inefficiencies in traditional cooling methods, leading to reliability issues and high energy consumption.

Innovation Solution

A system utilizing a large fan to cool multiple computing devices in a two-dimensional array, often with a shroud to prevent air leakage, reducing the need for individual device fans and improving airflow efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional cooling methods with individual device fans are used, then each device can be cooled independently, but the overall cooling efficiency is low and energy consumption is high

Engineering Contradiction:
Improveenergy consumptionVSAvoidcooling efficiency
Core Design Contradiction:
Loss of energyVSProductivity

Solution Approach 1:

The patent combines multiple individual device cooling functions into a single large-scale cooling system that serves multiple computing devices simultaneously. The array configuration and shared fan infrastructure merge previously separate cooling operations into one unified system, reducing total energy consumption while improving overall cooling efficiency through centralized air movement and heat extraction.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If refrigeration is used to cool the air, then the temperature of air forced across computing devices is reduced, but significant additional energy is consumed

Engineering Contradiction:
Improveair temperatureVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The system allows computing devices to cool themselves through the shared fan infrastructure without requiring external refrigeration systems. The natural air flow generated by the array fans creates sufficient cooling through convection and heat exchange, enabling devices to self-regulate temperature without consuming additional energy on refrigeration equipment.

Inventive Principle:
Principle #25Self-service

3Temperature

If high speed fans are used in each device, then cooling capability is improved, but the heat and constant operation negatively impact reliability and longevity

Engineering Contradiction:
Improvecooling capabilityVSAvoidcomponent reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent merges multiple high-speed fan operations into fewer, larger fans that operate at lower speeds to achieve the same cooling effect. This consolidation reduces the mechanical stress and operational wear on individual fan components, thereby improving reliability and longevity while maintaining adequate cooling capability through the array configuration.

Inventive Principle:
Principle #5Merging (Combining)

4Temperature

If many small fans are used for each device, then individual device cooling is adequate, but the system complexity and maintenance requirements increase

Engineering Contradiction:
Improvedevice coolingVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent consolidates numerous individual fan systems into a unified array configuration with shared cooling infrastructure. This merging reduces system complexity by eliminating redundant components and simplifying the overall architecture, while maintenance requirements decrease due to fewer moving parts and standardized cooling units that can be serviced more efficiently.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency, reduces maintenance costs, and decreases energy consumption by using fewer, larger fans operating at lower RPMs, thereby improving the reliability and longevity of computing devices.

Implementation Method 1

a fan configured to move air (e.g., push or pull) through the array of computing devices

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

force air across heat sinks on the computing device in order to extract and exhaust the waste heat

Methodology Applied
Scientific EffectHeat Sink: Heat Sink

Data Source

PatentUS12575066B2System for cooling computing devices in an array
Publication Date: 2026.03.10 CORE SCI INC
  • US12575066B2 patent drawing
  • US12575066B2 patent drawing
  • US12575066B2 patent drawing

AI summary

A system for cooling a two-dimensional array of computing devices is disclosed. A fan is configured to move air through the array of computing devices, which may be fan-less. The fan's width and height may correspond to the two-dimensional array's width and height. The two-dimensional array may be radially configured, and a shroud may be connected between the fan and the array of computing devices. The shroud may have profiles matching the fan and the array of computing devices.