Shared Firmware Memory Architecture for Multi-IC PCB Space Reduction

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Solution Overview

Problem

Conventional electronic apparatuses require multiple memory chips for different firmware codes, leading to increased PCB space occupation and manufacturing costs, as well as cumbersome and inefficient firmware updates due to the need for separate tools and programs for each integrated circuit.

Innovation Solution

An electronic apparatus utilizing a nonvolatile memory to store and manage firmware codes for multiple integrated circuits, where one integrated circuit can read and emulate the memory access interface for another, allowing all firmware codes to be stored collectively and updated using a single tool.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple separate memory chips are used to store firmware codes for different integrated circuits, then each integrated circuit can directly access its firmware code, but the PCB space occupation increases and manufacturing costs increase

Engineering Contradiction:
Improvefirmware access reliabilityVSAvoidPCB space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges multiple separate memory chips into a single non-volatile memory device that stores firmware codes for multiple integrated circuits. This consolidation reduces PCB space occupation while maintaining reliable firmware access through the emulation mechanism.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The non-volatile memory device serves multiple functions by storing firmware codes for different integrated circuits and providing emulation capabilities. This multi-functional approach eliminates the need for separate dedicated memory chips for each integrated circuit.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple separate memory chips are used to store firmware codes for different integrated circuits, then each integrated circuit has dedicated firmware storage, but manufacturing costs increase

Engineering Contradiction:
Improvefirmware storage reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple memory functions into a single non-volatile memory device, reducing component count and assembly complexity. This merging approach lowers manufacturing costs while maintaining reliable firmware storage through the shared memory architecture with emulation support.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The universal non-volatile memory device replaces multiple dedicated memory chips, simplifying the manufacturing process and reducing costs. The emulation capability ensures that each integrated circuit can still access its specific firmware code reliably.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If different firmware codes are stored in different memory chips, then each integrated circuit can independently access its firmware, but firmware update becomes cumbersome and inefficient

Engineering Contradiction:
Improvefirmware independenceVSAvoidfirmware update efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges multiple firmware storage locations into a single non-volatile memory device, enabling unified firmware update operations. This consolidation allows all firmware codes to be updated simultaneously through one update process, dramatically improving update efficiency while maintaining the ability to access specific firmware codes independently.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The universal non-volatile memory device provides both independent firmware storage and unified update capabilities. The emulation interface allows each integrated circuit to access its specific firmware while the shared architecture enables efficient bulk updates.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Speed

If separate memory chips are used for each integrated circuit, then firmware codes can be directly accessed, but the number of components and system complexity increases

Engineering Contradiction:
Improvefirmware access speedVSAvoidsystem component count
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent merges multiple memory chips into a single non-volatile memory device with emulation capability. This reduces the number of components and system complexity while maintaining fast firmware access through the emulation interface that provides direct access semantics to each integrated circuit.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The non-volatile memory device acts as an intermediary that provides direct access semantics to multiple integrated circuits simultaneously. The emulation interface mediates between the physical shared memory and the logical separate memory appearance, reducing component count while maintaining access performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10977057B2Electronic apparatus capable of collectively managing different firmware codes and operation method thereof
Publication Date: 2021.04.13 VIA LABS INC
  • US10977057B2 patent drawing
  • US10977057B2 patent drawing
  • US10977057B2 patent drawing

AI summary

An electronic apparatus and an operation method thereof are provided. The electronic apparatus includes a nonvolatile memory, a first integrated circuit and a second integrated circuit. The nonvolatile memory stores the first firmware code of the first integrated circuit and the second firmware code of the second integrated circuit. The first integrated circuit is coupled to a memory access interface of the nonvolatile memory to read the first firmware code and the second firmware code. The first integrated circuit has an emulation memory access interface to emulate an emulation memory. The second integrated circuit is coupled to the emulation memory access interface of the first integrated circuit. The second integrated circuit reads the second firmware code from the first integrated circuit via the emulation memory access interface.