Shared Heat Dissipation Device for Multi-Package IC Assemblies
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Solution Overview
Problem
As integrated circuit packages become smaller and more densely packed, they face challenges in heat dissipation due to increased power consumption and limited space for thermal solutions, which can lead to elevated junction temperatures and potential damage to circuits.
Innovation Solution
Implementing a shared heat dissipation device between multiple integrated circuit packages, such as a liquid cooling device or heat pipe, to efficiently manage heat transfer and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuit packages are positioned closer to one another to achieve smaller multi-package assemblies, then the size of the multi-package assembly is reduced, but the heat dissipation capability deteriorates due to limited space for thermal solutions
Solution Approach 1:
The patent combines multiple heat dissipation devices into a single shared thermal management system. Multiple integrated circuit packages share a common heat dissipation device, allowing efficient heat removal from multiple sources while reducing the overall space required for thermal solutions. This merging approach directly addresses the contradiction by enabling compact packaging without sacrificing heat dissipation capability.
2Productivity
If the density of power consumption of components is increased to achieve faster and smaller integrated circuit packages, then the performance and compactness are improved, but the junction temperature increases which may damage circuits
Solution Approach 1:
The patent extracts heat from high-power-density integrated circuit devices through dedicated heat dissipation devices. By removing heat at the source through heat sinks, heat pipes, or liquid cooling systems, the junction temperature is controlled even as power density increases. This extraction approach enables higher performance and compactness without thermal damage.
3Volume of moving object
If limited space is available for thermal solutions in densely packed assemblies, then the compactness is improved, but the effectiveness of heat removal deteriorates
Solution Approach 1:
The patent implements shared heat dissipation devices that serve multiple integrated circuit packages simultaneously. A single thermal management system performs the heat removal function for multiple devices, maximizing the effectiveness of heat removal within limited space. This multi-functional approach ensures reliable thermal management without requiring separate solutions for each package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the risk of circuit damage by enhancing heat dissipation capabilities within densely packed multi-package assemblies, maintaining optimal operating temperatures.
Implementation Method 1
a heat dissipation device, wherein the heat spreader of the first integrated circuit package is in thermal contact with the heat dissipation device and the heat spreader of the second integrated circuit package is in thermal contact with the heat dissipation device
Implementation Method 2
liquid cooling device or heat pipe
Implementation Method 3
heat pipe
Data Source
AI summary
Integrated circuit assemblies, electronic systems, and methods for fabricating the same are disclosed. An integrated circuit assembly is formed by thermally contacting at least two integrated circuit packages to opposite sides of a shared heat dissipation device. In one embodiment, the at least two integrated circuit packages are electrically attached to an electronic card to form an intermediate integrated circuit assembly. In a further embodiment, the integrated circuit assembly includes at least one intermediate integrated circuit assembly electrically attached to an electronic board.