Shared Heat Pipe Layout for Compact Electronic Cooling
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Solution Overview
Problem
Existing electronic apparatuses with cooling devices require significant space for heat sinks and heat pipes, leading to reduced space efficiency and potential heat backflow into the housing, which degrades cooling efficiency.
Innovation Solution
The electronic apparatus incorporates a cooling device with a first and second heat pipe, where the second heat pipe overlaps part of the first heat pipe and is positioned near the heat sink, allowing for shorter connection distances and reduced space usage, preventing heat backflow and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a pair of heat sinks and a pair of heat pipes are provided to cool the semiconductor chip, then cooling efficiency is improved, but space use efficiency in the housing is degraded
Solution Approach 1:
The patent merges the cooling functions for multiple semiconductor chips by using a shared heat sink and overlapping heat pipe arrangements. The first and second heat pipes overlap with each other and share a common heat sink, allowing multiple heat sources to be cooled through integrated thermal pathways rather than requiring separate cooling systems for each chip.
Solution Approach 2:
The heat pipes are arranged in a nested configuration where the first heat pipe and second heat pipe overlap with each other in space. This nesting arrangement allows the heat pipes to share portions of their length and thermal pathways, reducing the total volume required for the cooling system while maintaining effective heat transfer from multiple chips.
2Temperature
If the running distance of the heat pipes is made long to reach the heat sinks, then cooling coverage is improved, but heat backflow into the housing increases
Solution Approach 1:
The patent implements local quality by positioning heat releasing portions of the heat pipes at different locations within the housing. The first heat pipe has its heat releasing portion positioned differently from the second heat pipe, allowing heat to be discharged at optimized locations that minimize backflow into the housing while maintaining effective cooling coverage for each semiconductor chip.
Solution Approach 2:
The heat pipes are arranged in three-dimensional space with overlapping configurations and different spatial orientations. By utilizing vertical and horizontal positioning variations, the system achieves effective cooling coverage without requiring excessively long horizontal runs that would increase heat backflow risk into the housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves space efficiency and prevents heat backflow, resulting in efficient cooling of components without increasing the apparatus's thickness or degrading cooling performance.
Implementation Method 1
The heat received by the connecting blocks is conducted to the respective heat sinks through respective heat pipes
Implementation Method 2
The heat sinks discharge the heat to the outside of the housing
Implementation Method 3
The fan unit has a pair of air outlets to supply air to the heat sinks
Data Source
AI summary
According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe which thermally connects the first heat emitter with the heat sink, a second heat pipe, and a fan unit which cools the heat sink and the second heat pipe. The second heat pipe has a first end portion which is thermally connected to the second heat emitter, and a second end portion which is located near the heat sink.