Shared Heat Sink Packaging for Compact DC/DC Converters
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Solution Overview
Problem
High-power DC/DC converter systems face challenges in minimizing footprint and accommodating space constraints while maintaining efficient cooling in applications like battery-powered machines, where large components and space limitations hinder the effective packaging and cooling of converters.
Innovation Solution
The solution involves an assembly where two or more DC/DC converters share a common heat sink assembly within a single enclosure, simplifying the cooling system and reducing the overall footprint by mechanically coupling power electronic modules to a shared dual-sided heat sink, which defines channels for a fluid cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate heat sink assemblies are used for each DC/DC converter, then each converter can be cooled independently, but the overall system footprint and cooling line complexity increase
Solution Approach 1:
The patent combines multiple heat sink assemblies into a single shared heat sink that serves multiple DC/DC converters. The shared heat sink includes multiple heat dissipation surfaces coupled to different power electronic modules, allowing one heat sink structure to perform the cooling function that would otherwise require separate heat sinks for each converter.
Solution Approach 2:
The shared heat sink is designed to perform multiple cooling functions simultaneously by providing multiple heat dissipation surfaces that can be coupled to different power electronic modules from different DC/DC converters. This multi-functional design allows a single component to replace multiple separate cooling assemblies.
2Reliability
If separate cooling lines are routed to each DC/DC converter, then each converter receives adequate cooling, but the cooling system complexity and number of components increase
Solution Approach 1:
The patent merges multiple separate cooling lines into a single shared cooling line that provides cooling fluid to the shared heat sink. This consolidation reduces the number of cooling lines, connectors, and associated components while maintaining adequate cooling for all power electronic modules through the shared heat dissipation surfaces.
3Reliability
If multiple separate heat sink assemblies are used, then each power electronic module can be cooled independently, but the number of components and assembly complexity increase
Solution Approach 1:
The patent merges multiple separate heat sink assemblies into a single integrated shared heat sink structure that includes multiple heat dissipation surfaces. This consolidation reduces the total number of heat sink components from multiple separate assemblies to one unified structure, thereby reducing component count and assembly complexity.
Solution Approach 2:
While consolidating into a single shared heat sink, the patent segments the heat dissipation function by providing multiple distinct heat dissipation surfaces within the shared structure. Each surface can be independently coupled to different power electronic modules, maintaining modular cooling capability without requiring multiple separate heat sink assemblies.
4Ease of operation
If DC/DC converters are packaged in separate enclosures, then each converter is isolated and easier to service, but the overall system footprint increases
Solution Approach 1:
The patent merges multiple DC/DC converters into a single shared enclosure, consolidating what would otherwise be separate enclosed units into one integrated package. This reduces the overall system footprint by eliminating the need for multiple separate enclosure structures while maintaining the converters' functional independence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach efficiently packages DC/DC converters, reduces the complexity of cooling lines, and minimizes the footprint of high-power DC/DC converter systems, addressing space constraints and cooling efficiency in high-power applications.
Implementation Method 1
a heat sink assembly mechanically coupled to the second power electronic module and the fourth power electronic module
Implementation Method 2
the heat sink assembly defines a channel configured to receive a fluid of a fluid cooling system
Data Source
AI summary
An assembly for two (or more) DC/DC converters located in a common enclosure, where the DC/DC converters share a heat sink assembly, such as a shared dual-sided heat sink assembly. The techniques efficiently package the components of the DC/DC converters within a common enclosure and simplify the cooling lines routed to those components.