Shared Heat Transfer Component for Symmetrical Dual-Processor Cooling

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Solution Overview

Problem

In computing systems, dual-processor circuit boards face challenges with uneven cooling due to obstructed air channels, leading to temperature asymmetry and performance disparities between processors, which are addressed by using a single heat transfer component shared between two circuit boards to regulate temperatures symmetrically.

Innovation Solution

A heat transfer system with a single heat transfer component situated between two circuit boards, enabling thermal communication with both processors to maintain symmetrical temperatures, potentially including active or passive components like fans and heat sinks, and allowing for larger, more efficient cooling solutions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dedicated on-board heat transfer component is used for each processor circuit board, then each processor can be cooled independently, but the system cost increases and manufacturing complexity increases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidsystem complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple heat transfer functions into a single shared heat transfer component that serves multiple processors on different circuit boards. This component is positioned in communication with both circuit boards and includes features like heat sinks and fans that can cool multiple processors simultaneously, thereby reducing the total number of components while maintaining cooling effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shared heat transfer component is designed to perform multiple cooling functions for different processors. It includes universal features such as heat dissipation structures and airflow generation capabilities that can serve multiple circuit boards, making a single component capable of performing what previously required multiple dedicated components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If dual-processor circuit boards are positioned on a motherboard with obstructed air channels, then space is optimized, but temperature asymmetry and performance disparity occur between processors

Engineering Contradiction:

Improvemotherboard space utilizationVSAvoidtemperature symmetry

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The heat transfer component is designed with asymmetric features tailored to the specific thermal requirements of each processor location. The component can provide different cooling intensities or patterns to different processors based on their individual thermal loads and environmental conditions, ensuring each processor receives appropriate cooling despite asymmetric airflow conditions.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The shared heat transfer component acts as an intermediary between the processors and the cooling airflow. It includes features like heat sinks that facilitate heat transfer from both processors and fans that generate and distribute cooling airflow, mediating the thermal management for multiple processors in a space-constrained environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If one processor receives cooling air via a choked channel while another receives adequate airflow, then space is optimized, but manufacturing precision requirements increase to ensure symmetrical performance

Engineering Contradiction:

Improvemotherboard space utilizationVSAvoidperformance symmetry

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The heat transfer component can dynamically adjust cooling parameters such as fan speed, airflow distribution, and heat sink engagement to compensate for asymmetric thermal conditions. This allows the system to maintain symmetrical processor performance despite differences in natural airflow availability, reducing the need for precise manufacturing tolerances.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures symmetrical performance across processors, reduces manufacturing costs, and increases reliability by using a single heat transfer component instead of multiple dedicated ones, while providing enhanced airflow and noise attenuation.

Implementation Method 1

the heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat transfer component is situated between the first circuit board and the second circuit board

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS7969733B1Heat transfer system, method, and computer program product for use with multiple circuit board environments

Publication Date: 2011.06.28 NVIDIA CORP

AI summary

A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.