Shared Laser Distribution for Multi-Chamber Substrate Processing
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Solution Overview
Problem
High-cost laser devices used in semiconductor processes for thermal atomic layer etching (ALE) and atomic layer deposition (ALD) require efficient usage, as existing methods are inefficient and costly due to the need for multiple laser devices for each substrate processing apparatus.
Innovation Solution
A substrate processing module and method that utilizes a single or small number of laser devices to generate pulsed laser beams, distributing them to multiple substrate processing apparatuses at time intervals through a laser beam distribution unit, allowing efficient heating of substrates during ALE or ALD processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laser device is installed in each substrate processing apparatus to enable independent operation, then each apparatus can process substrates independently, but the overall system cost increases significantly
Solution Approach 1:
The patent implements a shared laser beam generator that can serve multiple substrate processing apparatuses through time-division multiplexing. The single laser device is controlled to provide laser beams to different apparatuses at different time intervals, making it a universal resource that replaces the need for dedicated laser devices in each apparatus, thereby reducing overall system cost while maintaining processing capability.
Solution Approach 2:
The patent combines multiple laser beam delivery functions into a single laser beam generator. By merging the laser sources and using a shared beam distribution system with time-division control, the patent consolidates what would otherwise be separate laser devices into one unified system, reducing redundancy and lowering the total number of components required.
2Device complexity
If multiple substrate processing apparatuses share a single laser device, then system cost is reduced, but the laser device must operate at high capacity to serve all apparatuses
Solution Approach 1:
The patent employs time-division multiplexing where the single laser device operates periodically, alternating between serving different substrate processing apparatuses. The laser beam is distributed to apparatuses at different time intervals, allowing each apparatus to receive full-power laser beams during its designated time slot. This periodic operation enables cost reduction through sharing while maintaining adequate power levels for each processing operation.
3Productivity
If laser beams are distributed to multiple apparatuses simultaneously, then processing throughput increases, but the laser device becomes overly complex and expensive
Solution Approach 1:
The patent uses time-division multiplexing to distribute laser beams to multiple apparatuses sequentially rather than simultaneously. Each apparatus receives laser beams during specific time intervals, creating a periodic pattern of beam distribution. This approach maintains high processing throughput by keeping apparatuses actively processing while avoiding the complexity of simultaneous multi-path beam splitting systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the process time and minimizes substrate damage by rapidly heating substrates with pulsed laser beams, while also lowering the overall cost by sharing laser devices among multiple apparatuses, thus enhancing the efficiency and cost-effectiveness of the semiconductor processing.
Implementation Method 1
a laser unit for heating the substrate by irradiating a laser beam onto the substrate
Implementation Method 2
a plasma source for forming plasma from the process gas supplied into the processing space
Implementation Method 3
a reactive gas supplied into a process chamber forms plasma by obtaining energy required for ionization from an induced electric field
Data Source
AI summary
Provided is a substrate processing module including a plurality of substrate processing apparatuses each including a process chamber having a processing space therein, a support unit for supporting a substrate in the processing space, a gas supply unit for supplying a process gas into the processing space, a plasma source for forming plasma from the process gas supplied into the processing space, and a laser unit for heating the substrate by irradiating a laser beam onto the substrate, wherein the substrate processing module further includes a laser beam generator for generating a laser beam, and a laser beam distribution unit for receiving the laser beam from the laser beam generator and distributing the laser beam to the laser units of the plurality of substrate processing apparatuses at time intervals.