Shared Membrane Thermopile Sensor Array Thermal Isolation
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Solution Overview
Problem
Conventional thermopile sensor arrays suffer from reduced thermal sensitivity and increased noise due to the presence of cold frames between pixels, which limits the temperature gradient and requires greater amplification, leading to space inefficiency and inaccurate measurements.
Innovation Solution
A thermopile sensor array with a shared membrane structure, where multiple thermopiles are arranged on a single continuous membrane with reduced spacing between them, eliminating the need for individual cold frames and enhancing thermal isolation, thereby increasing the temperature gradient and measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual cold frames are placed around each pixel to form separate membranes, then thermal isolation is improved, but the temperature gradient magnitude is reduced and device area is wasted
Solution Approach 1:
The patent merges the support structures of multiple adjacent thermopiles into a single shared membrane. Instead of providing individual cold frames around each pixel, a common membrane supports multiple thermopiles simultaneously. This eliminates the need for redundant cold frames between pixels while maintaining thermal isolation, as the shared membrane extends the thermal path length without requiring additional cold frame structures around each pixel.
2Strength
If individual cold frames are placed around each pixel, then structural support is improved, but valuable space is consumed and pixel density is reduced
Solution Approach 1:
The patent combines multiple individual support structures into a single shared membrane that supports multiple thermopiles. This shared membrane provides structural support for all adjacent pixels simultaneously, eliminating the need for separate cold frames around each pixel and removing the dead spaces between them, thereby increasing pixel density.
Solution Approach 2:
The shared membrane serves multiple functions: it provides structural support for multiple thermopiles, acts as a thermal isolation barrier, and eliminates dead spaces between pixels. This multi-functional design replaces the need for individual cold frames that would only provide structural support for a single pixel.
3Area of stationary object
If multiple thermopiles are arranged in close proximity, then device compactness is improved, but thermal interference between adjacent pixels increases
Solution Approach 1:
The patent merges the thermal isolation function into a shared membrane structure that extends between multiple thermopiles. This shared membrane creates a continuous thermal barrier that prevents heat from one pixel from conducting to adjacent pixels, even when thermopiles are arranged in close proximity, thereby reducing thermal interference while maintaining compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shared membrane design enhances pixel density, increases temperature gradients, and reduces amplification noise, resulting in more accurate and sensitive infrared radiation measurements with improved space utilization.
Implementation Method 1
The collected IR energy creates a temperature gradient across the thermocouple, causing the thermocouple to generate an output voltage via the Seebeck effect.
Implementation Method 2
one or more absorbers thermally coupled to each of the plurality of thermopiles, wherein each of the plurality of thermopiles is operable to generate a voltage in response to receiving radiation from the one or more absorbers
Data Source
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AI summary
A thermopile sensor array is provided. The thermopile sensor array may include multiple pixels formed by multiple thermopiles arranged on a single common shared support membrane. A separation between the edge of the shared support membrane and the outermost thermopile(s) may be included to provide additional thermal isolation between the thermopile and an underlying silicon substrate.