Shared Opening Circuit Board for Electro-Optic Devices
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Solution Overview
Problem
The existing manufacturing process for circuit boards in electro-optic devices requires high alignment accuracy for small contact holes, leading to low yield and increased production costs due to the need for high-performance alignment machines.
Innovation Solution
A circuit board design where multiple electrodes share a single opening to connect to transistors, reducing the stringent alignment requirements and allowing for larger contact holes, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If one opening is formed for every electrode to achieve one-to-one correspondence, then alignment precision is maintained, but manufacturing complexity increases and yield decreases
Solution Approach 1:
The patent merges multiple electrode openings into a single shared opening that serves multiple electrodes. Specifically, one opening in the insulating layer is formed for every electrode group (containing at least two adjacent electrodes), and each electrode in the group connects to the transistor through this shared opening. This reduces the total number of openings from one-per-electrode to one-per-electrode-group, thereby improving yield while maintaining adequate alignment precision.
2Length of moving object
If one opening is formed for every electrode, then electrode-to-electrode distance can be decreased, but alignment accuracy requirement increases
Solution Approach 1:
By combining multiple electrodes into groups that share a single opening, the patent allows for larger opening sizes while maintaining functional connectivity. This merging approach reduces the alignment accuracy requirement because the opening serves multiple electrodes simultaneously, eliminating the need for extremely precise one-to-one alignment between each electrode and its dedicated opening.
3Length of moving object
If small contact holes are formed for high electrode density, then electrode-to-electrode distance decreases, but device complexity increases
Solution Approach 1:
The patent reduces device complexity by merging the opening structure so that one opening serves multiple electrodes instead of requiring separate openings for each electrode. This simplifies the overall device architecture and manufacturing process while still achieving the goal of decreased electrode-to-electrode distance through the shared opening configuration.
Data Source
AI summary
A circuit board includes a substrate; a plurality of scan lines disposed on the substrate, the scan lines extending in a first direction; a plurality of signal lines disposed on the substrate, the signal lines extending in a second direction intersecting the first direction; a plurality of transistors, each of which is electrically connected to corresponding one of the plurality of scan lines and corresponding one of the plurality of signal lines; an insulating layer that covers the plurality of scan lines, the plurality of signal lines, and the plurality of transistors; and a plurality of electrodes, each of which is electrically connected to corresponding one of the plurality of transistors. One opening is formed in the insulating layer for every electrode group, the electrode group being constituted by at least two adjacent electrodes among the plurality of electrodes, and each of the plurality of electrodes is electrically connected to the corresponding one of the transistors through the opening.