Shared Output Lead Packaging for Multi-Die Doherty Amplifiers
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Solution Overview
Problem
Doherty amplifiers with multiple stages face complexity and space constraints in output matching circuits, leading to inefficiencies and narrow band performance, especially as the number of amplifiers increases, due to the need for precise phasing and impedance matching.
Innovation Solution
A semiconductor device package with a combined output lead that internally combines the outputs of multiple transistor amplifier dies, allowing for simpler and more flexible output matching, utilizing an edge plane configuration for signal combination and load modulation from complex-to-complex loads, reducing the need for separate matching leads and enabling easier scaling for higher power applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate output leads are used for each transistor amplifier die, then each amplifier can be independently matched, but the device complexity and space requirements increase significantly
Solution Approach 1:
The patent combines multiple separate output leads into a single shared output lead that serves multiple transistor amplifier dies. This merging approach reduces the number of separate matching circuits required while maintaining the ability to independently match each amplifier through individual series inductors connected to the shared lead, thereby reducing device complexity and space requirements
2Reliability
If multiple separate output leads are used for each transistor amplifier die, then each amplifier can be independently matched, but the package area and space requirements increase
Solution Approach 1:
The patent merges multiple output leads into a single shared output lead structure, significantly reducing the package area required for output connections. This is achieved by having multiple transistor amplifier dies connect their outputs to a common lead through individual series inductors, eliminating the need for separate dedicated output leads for each die and thereby reducing overall package footprint
3Device complexity
If a single shared output lead is used for multiple transistor amplifier dies, then device complexity and space are reduced, but signal combination and phasing become more difficult
Solution Approach 1:
The patent introduces series inductors as intermediary elements between each transistor amplifier die and the shared output lead. These inductors serve as mediators that enable independent impedance matching and signal phasing control for each amplifier while still using the shared output lead, thereby maintaining signal precision without requiring separate dedicated leads
4Power
If traditional separate lead configurations are used, then signal paths are simple, but scalability to higher power applications is limited
Solution Approach 1:
The patent creates a universal shared output lead structure that can accommodate multiple transistor amplifier dies and scale to higher power applications. This multi-functional lead configuration serves as a common output path for multiple amplifiers while allowing independent matching through series inductors, enabling the system to scale in power capability without proportionally increasing lead complexity
Data Source
AI summary
A semiconductor device package includes a plurality of input leads, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combined output lead configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal.