Shared Pad Geometry for Component Mounting Alignment
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Solution Overview
Problem
In printed circuit boards, mounting electronic components of different sizes on shared pads can lead to misalignment and the generation of solder balls, making the inspection process time-consuming, especially when large components are involved.
Innovation Solution
The design of shared pads with distinct areas and sloping side edges allows for the secure mounting of electronic components of varying sizes by guiding terminals to precise positions, reducing misalignment and improving solder wettability, thereby enhancing mounting reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If shared pads of maximum size are used to mount electronic components of different sizes, then all components can be mounted on the same pad group, but misalignment and solder ball generation occur during mounting
Solution Approach 1:
The shared pad is divided into multiple pad regions, each with different sizes and shapes matched to specific electronic components. This segmentation allows each component to be precisely positioned on its corresponding pad region, eliminating misalignment while maintaining the ability to mount different component sizes on the same pad group.
Solution Approach 2:
Different regions of the shared pad are designed with locally optimized dimensions and geometries to match the specific requirements of each electronic component. This local customization ensures precise alignment for each component type while maintaining overall pad group compatibility.
2Adaptability or versatility
If shared pads of maximum size are used, then component compatibility is improved, but solder ball generation increases
Solution Approach 1:
By segmenting the shared pad into multiple pad regions with precise dimensions, each region provides an optimal soldering surface for its corresponding component. This prevents excess solder from spreading uncontrollably, thereby reducing solder ball generation while maintaining compatibility with different component sizes.
Solution Approach 2:
Each pad region is designed with locally optimized geometry and dimensions that match the specific component requirements, ensuring proper solder flow and connection without generating solder balls. This local precision eliminates the harmful effect of solder ball formation.
3Reliability
If inspection for misalignment is performed, then mounting quality is ensured, but inspection time increases
Solution Approach 1:
The pad regions are pre-designed with distinct sizes, shapes, and geometries that provide built-in alignment guidance for each electronic component. This preliminary design feature ensures that components self-align during mounting, eliminating misalignment before it occurs and removing the need for time-consuming inspection processes.
Solution Approach 2:
The varied pad region geometries provide self-aligning features that guide electronic components into correct positions during mounting. This self-service alignment mechanism ensures mounting quality without requiring external inspection, thereby reducing inspection time.
Data Source
AI summary
According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.