Circuit Board Pad Sharing for Mixed-Size Component Mounting
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Solution Overview
Problem
Existing circuit board designs struggle with efficient arrangement of pads for electronic parts of varying sizes, leading to increased board size and inefficient use of space.
Innovation Solution
A circuit board design that arranges pads on the first surface to accommodate both small and large electronic parts by placing pads in a specific configuration, allowing for non-overlapping mounting of parts with shared wiring patterns, thereby reducing the overall board size and optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If pads for electronic parts of different sizes are arranged separately, then each part can be mounted independently, but the circuit board size increases
Solution Approach 1:
The patent merges the pad arrangements for different electronic parts by positioning pads of smaller parts between pads of larger parts on the same circuit board surface. This overlapping arrangement allows multiple electronic parts to share the same mounting region, thereby reducing the overall circuit board size while maintaining compatibility with different part sizes
Solution Approach 2:
The patent utilizes the two-dimensional surface of the circuit board more efficiently by arranging pads in a layered fashion - smaller pads are positioned in the gaps between larger pads. This dimensional optimization allows multiple parts to be accommodated within the same footprint area, reducing the total board size without compromising adaptability
2Adaptability or versatility
If pads are arranged to accommodate largest electronic parts, then all parts can be mounted, but space utilization decreases
Solution Approach 1:
The patent applies local quality by differentiating pad sizes and positions according to the specific requirements of different electronic parts. Larger pads are positioned for larger parts, while smaller pads are strategically placed in between to accommodate smaller parts. This localized optimization ensures that each part can be mounted while maximizing overall space utilization
Solution Approach 2:
The patent segments the pad arrangement into distinct zones - pads for larger electronic parts are positioned at the periphery, while pads for smaller parts are placed in the intermediate regions. This segmentation allows efficient space utilization while maintaining the ability to mount all types of electronic parts
Data Source
AI summary
A circuit board having a first surface includes a first electronic part mounted on the first surface and comprising a first terminal and a second terminal, a first pad which is placed on the first surface and to which the first terminal of the first electronic part is connected, a second pad which is placed on the first surface and to which the second terminal of the first electronic part is connected, and a third pad and a fourth pad which are placed on the first surface and to which terminals of a second electronic part are connectable, the second electronic part being a different part from the first electronic part, wherein the third pad is placed between the first pad and the second pad in a first direction along the first surface.