Imaging Sensor Shared Pixel Readout Circuitry
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Solution Overview
Problem
Time-of-flight (TOF) camera systems face limitations in depth detection due to infrared filtering components, which reduce sensitivity and attenuate infrared illumination, and separate imaging sensors lead to bulky equipment, increased cost, and parallax issues, along with high power consumption and sensitivity challenges.
Innovation Solution
A single pixel arrangement on a semiconductor substrate that concurrently detects both infrared and visible light using interspersed pixel structures with shared output circuits, reducing system complexity and power consumption while enhancing spatial resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate imaging sensors are used for infrared and visible light, then detection capability is improved, but device complexity and size increase
Solution Approach 1:
The patent combines infrared and visible light detection capabilities into a single integrated imaging sensor device. The sensor array includes both infrared-sensitive pixels and visible light-sensitive pixels within the same semiconductor substrate, allowing simultaneous detection of both light types without requiring separate sensor systems. This merging approach maintains comprehensive detection capability while reducing overall system complexity and size.
Solution Approach 2:
The imaging sensor is designed with multi-functional pixel elements that can detect different types of light (infrared and visible) depending on their specific structural configuration. Some pixels are optimized for infrared detection while others are optimized for visible light, allowing a single universal sensor device to perform multiple detection functions that would traditionally require separate specialized sensors.
2Measurement precision
If infrared filtering components are added, then depth detection accuracy is improved, but sensitivity and intensity are reduced
Solution Approach 1:
The sensor array employs local differentiation in pixel properties, where specific pixels are designed with infrared filtering characteristics while adjacent pixels remain sensitive to both infrared and visible light. This local quality approach allows depth detection accuracy to be improved in specific regions without compromising the overall infrared sensitivity of the entire sensor array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved spatial resolution and reduced system cost by integrating infrared and visible light detection in a single pixel array, overcoming depth limitations and parallax issues, and minimizing power consumption.
Implementation Method 1
a first pixel element configured to detect the infrared light
Implementation Method 2
a second pixel element configured to detect the visible light
Data Source
AI summary
Imaging sensors that detect infrared and visible light are provided herein. In one example, an imaging sensor is presented that includes a semiconductor substrate comprising an array of pixel structures for concurrently sensing infrared light and visible light. Each of the pixel structures include a first pixel element configured to detect the infrared light and a second pixel element configured to detect the visible light. Each of the pixel structures further include a shared output circuit that couples the first pixel element and the second pixel element such that a first output state presents a first signal corresponding to detected infrared light of the first pixel element and a second output state presents a second signal corresponding to detected visible light of the second pixel element.