Shared Power Supply Interconnection for Semiconductor IC Pad Reduction
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Solution Overview
Problem
The increasing number of pads required for memory inspection in semiconductor integrated circuits due to the integration of multiple internal power supply circuits and memory circuits on a single chip, leading to higher chip costs and area usage, is a challenge that existing technologies have not adequately addressed.
Innovation Solution
A semiconductor integrated circuit design that includes a shared power supply interconnection and a single external pad to control the delivery of supply voltage to multiple circuit blocks, using AND and OR circuits to manage power supply control signals and mode registers to select and configure internal power supply circuits for test modes, reducing the need for individual pads and allowing voltage trimming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple internal power supply circuits are integrated on a single chip with multiple memory circuits, then the functionality and performance of the semiconductor integrated circuit are improved, but the number of pads required for memory inspection increases
Solution Approach 1:
Multiple internal power supply circuits are merged into a single chip architecture, sharing common power supply lines and control mechanisms. This consolidation allows multiple memory circuits to be powered by the same internal power supply circuits, reducing the need for separate external pads for each circuit while maintaining full functionality.
Solution Approach 2:
The internal power supply circuits are designed to serve multiple functions: they provide power to multiple different memory circuits, enable inspection modes through shared control signals, and reduce the overall pad count by creating a universal power distribution network that replaces what would otherwise require multiple dedicated external connections.
2Productivity
If multiple internal power supply circuits are integrated on a single chip, then the performance of the semiconductor integrated circuit is improved, but the chip area increases
Solution Approach 1:
Multiple memory circuits are combined on a single chip and powered by shared internal power supply circuits. This merging approach increases overall system performance by integrating more functionality while managing chip area through efficient resource sharing rather than duplicating power supply infrastructure for each memory circuit.
Solution Approach 2:
The patent transitions from a distributed power supply architecture (requiring separate external pads and independent power paths) to an integrated internal power supply architecture. This dimensional shift in system organization allows multiple memory circuits to be densely packed on the chip with shared power distribution, improving performance without linearly increasing chip area.
3Ease of operation
If individual pads are provided for every internal voltage generator circuit, then the monitoring of power supply voltage is simplified, but the number of pads used increases
Solution Approach 1:
Control circuits are introduced as intermediary elements that manage the connection between external pads and internal power supply circuits. These control circuits enable a single external pad to monitor and control multiple internal power supply circuits by selectively connecting them through switching mechanisms, thereby reducing pad count while maintaining monitoring capability.
Solution Approach 2:
The internal power supply circuits are designed with self-monitoring capabilities through shared control signals. The circuits can be monitored and controlled through a common interface that manages multiple power supply units, allowing the system to maintain oversight of all internal voltage generators without requiring individual external pads for each circuit.
4Adaptability or versatility
If switches are used to control conduction between internal power supply circuits and monitoring pad, then the flexibility of power supply control is improved, but the device complexity increases
Solution Approach 1:
Multiple switching control functions are merged into unified control circuits that manage power supply connections for multiple internal circuits through a single interface. This consolidation provides the flexibility to control individual or groups of power supply circuits while avoiding the complexity of separate switching mechanisms for each circuit.
Solution Approach 2:
The control circuits are designed with universal functionality to handle multiple power supply circuits through standardized control signals. This multi-functional approach enables flexible power supply management across different memory circuits and operational modes without requiring circuit-specific control logic, thereby reducing overall device complexity while maintaining adaptability.
Data Source
AI summary
A semiconductor integrated circuit including on a single chip a plurality of circuit blocks and a plurality of internal power supply circuits for delivering a common supply voltage to the plurality of circuit blocks includes: a shared power supply interconnection for connecting the plurality of circuit blocks and the plurality of internal power supply circuits; and an external pad connected to the shared power supply interconnection. Whether or not each of the internal power supply circuits delivers the supply voltage is controlled by a certain power supply control signal.