Semiconductor Module Power Wiring Layout for Compact Motor Electronics
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Solution Overview
Problem
Existing electronic devices with semiconductor modules for electric motor applications face challenges in simplifying wiring connections, leading to increased impedance, inductance, and space requirements due to the need for separate wiring around each semiconductor module.
Innovation Solution
The integration of semiconductor elements within a resin mold on a wiring board, where at least part of the electrodes are mounted on the electric connection wiring, allowing for overlapping arrangements and reduced wiring complexity, thereby minimizing space and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor modules are arranged with separate wiring around each module, then wiring connections are established, but the impedance and inductance increase and space requirements increase
Solution Approach 1:
The patent merges the wiring structure by having multiple semiconductor modules share common electric connection wirings. Instead of providing separate wiring around each semiconductor module, the invention uses shared power supply wirings and ground wirings that multiple modules can connect to, thereby reducing the overall wiring complexity and the associated impedance and inductance while maintaining reliable electrical connections.
Solution Approach 2:
The patent arranges semiconductor modules in a configuration where they can share common wiring structures. By positioning modules around peripheral edges and using central power supply wirings, the invention creates a multi-dimensional wiring architecture that reduces the need for separate wiring loops around each module,从而降低阻抗和电感.
2Reliability
If separate wiring is provided around each semiconductor module, then wiring connections are established, but the space required increases
Solution Approach 1:
The patent combines the wiring resources by having multiple semiconductor modules share common electric connection wirings. The power supply wiring and ground wiring are established as shared infrastructure that multiple modules can connect to, eliminating the need for separate wiring loops around each module and thereby reducing the total area required on the wiring board.
Solution Approach 2:
The patent creates universal wiring structures that serve multiple functions. The power supply wirings and ground wirings are designed as common infrastructure that can be shared by multiple semiconductor modules, making the wiring system multi-functional and reducing the overall space requirements on the wiring board.
3Device complexity
If semiconductor modules are integrated with electrodes mounted on electric connection wiring, then wiring complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by pre-forming the electric connection wirings (power supply wirings and ground wirings) on the wiring board before mounting the semiconductor modules. The wirings are established in advance with proper positioning and connectivity, so that when modules are mounted, their electrodes can be directly connected to the pre-positioned wirings, reducing the overall manufacturing complexity despite requiring precise electrode alignment.
Data Source
AI summary
An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.