Shared Precursor Manifold With Gas Pulsing for Uniform Multi-Chamber Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing gas distribution systems for semiconductor processing waste expensive precursor gases by diverting them to the foreline when not in use and require costly dedicated delivery hardware for each wafer processing station, limiting efficiency and increasing costs.
Innovation Solution
A gas distribution apparatus with a shared volume and fast pulsing valves at each downstream end, minimizing precursor waste by ensuring uniform and reproducible delivery to multiple processing stations without the need for dedicated gas sticks, using a pressure controller and flow controllers with orifices to manage gas flow efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dedicated gas sticks are used for each wafer processing station, then gas delivery reliability is improved, but hardware cost increases
Solution Approach 1:
Multiple processing stations share a common gas distribution manifold instead of each station having its own dedicated gas stick. The manifold acts as a shared resource that distributes precursor gas to multiple stations simultaneously, reducing the total number of gas delivery components while maintaining reliable supply to each station.
Solution Approach 2:
The shared gas manifold serves multiple processing stations with a single gas delivery system, making the gas distribution infrastructure universal rather than station-specific. This multi-functional approach allows one gas delivery system to perform the function of multiple dedicated systems.
2Adaptability or versatility
If precursor gas is diverted to the foreline when not in use, then gas delivery flexibility is improved, but precursor waste increases
Solution Approach 1:
The system uses periodic pulsing of precursor gas to each processing station rather than continuous flow. Fast valves open and close in rapid succession to deliver precise amounts of gas only when needed, minimizing waste to the foreline while maintaining the flexibility to serve multiple stations dynamically.
Solution Approach 2:
The system incorporates pressure sensors and flow controllers that monitor gas delivery in real-time, providing feedback to the control system. This allows precise control of gas flow to each station, ensuring gas is delivered only when and where needed, thereby reducing waste while maintaining delivery flexibility.
3Productivity
If batch processing is used to maximize substrate processing rate, then productivity is improved, but processing uniformity becomes more difficult to maintain
Solution Approach 1:
The system delivers precursor gas in synchronized periodic pulses to multiple processing stations during batch processing. All stations receive gas at the same time intervals, ensuring uniform processing conditions across all substrates being processed simultaneously, thereby maintaining manufacturing precision while maximizing productivity.
Solution Approach 2:
Pressure sensors and flow controllers monitor gas distribution to each station in the batch processing system, providing real-time feedback to ensure uniform gas delivery across all processing chambers. This feedback mechanism maintains processing uniformity even as throughput increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces precursor waste and lowers hardware costs by enabling efficient, uniform, and reproducible gas delivery to multiple stations, maximizing throughput and processing efficiency in semiconductor processing.
Implementation Method 1
Each flow controller comprises an orifice and a fast pulsing valve
Implementation Method 2
A pressure controller is connected to the upstream end of the shared volume
Implementation Method 3
Each flow controller comprises an orifice and a fast pulsing valve
Data Source
AI summary
Gas distribution apparatus to provide uniform flows of gases from a single source to multiple processing chambers are described. A regulator is positioned at an upstream end of a shared volume having a plurality of downstream ends. A flow controller is positioned at each downstream end of the shared volume, the flow controller comprising an orifice and a fast pulsing valve. Methods of using the gas distribution apparatus and calibrating the flow controllers are also described.


