Shared SPM Cleaning Module for Post-CMP Chemical and Transfer Control
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Solution Overview
Problem
Current SPM cleaning processes for semiconductor substrates are inefficient and wasteful, requiring separate tanks for each substrate, leading to high operating costs and chemical usage, and are not compatible with single-substrate processing platforms due to issues with temperature control, cross-contamination, and robotic transfer sequencing.
Innovation Solution
A CMP cleaning system with a sulfuric peroxide mixture (SPM) tank and multiple processing chambers that allow multiple substrates to be processed in the same tank, sharing chemistry, and utilizing a series of tanks for preparation and post-cleaning processes, along with a transport system and robot arms for efficient substrate handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are processed through SPM cleaning tank in batches with separate tanks for each substrate, then cleaning effectiveness is maintained, but chemical usage increases and operating costs rise
Solution Approach 1:
The patent merges multiple substrate processing operations into a single shared SPM cleaning tank. Instead of using separate tanks for each substrate, the system allows multiple substrates to be processed sequentially in the same tank, thereby reducing chemical usage while maintaining cleaning effectiveness through proper substrate handling and tank design.
Solution Approach 2:
The SPM cleaning tank is designed to serve multiple substrates universally rather than being dedicated to a single substrate. The tank functions as a shared resource that can process different substrates in sequence, improving resource utilization and reducing overall chemical consumption across the manufacturing process.
2Ease of operation
If substrates are processed through SPM cleaning tank in batches with frequent lid opening, then substrate insertion is enabled, but temperature control deteriorates and cross-contamination risk increases
Solution Approach 1:
The system performs preliminary actions by pre-positioning substrates and preparing the cleaning tank before actual processing begins. This includes organizing substrates in advance and configuring the tank to minimize lid openings during the cleaning sequence, thereby maintaining temperature stability while ensuring smooth substrate insertion operations.
3Adaptability or versatility
If each substrate is exposed for different times due to robotic transfer sequencing, then flexible processing is achieved, but process control complexity increases
Solution Approach 1:
The system implements feedback mechanisms that monitor substrate processing times and robotic transfer sequences in real-time. This feedback enables dynamic adjustment of processing parameters to accommodate varying exposure times while maintaining consistent cleaning quality, thereby managing control complexity through intelligent monitoring and adaptation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances throughput, reduces chemical usage, and maintains chemistry consistency, while integrating SPM processing within a single-substrate platform, minimizing cross-contamination and operational expenses.
Implementation Method 1
a mixture of sulfuric acid and hydrogen peroxide (e.g., sulfuric peroxide mixture (SPM)) can be used in the removal or dissolution of cerium oxide particulates from the surfaces of a substrate after polishing
Implementation Method 2
SPM cleaning can be performed in a parallel separated mode in which each substrate is placed in a bath in a separate tank
Data Source
AI summary
A substrate cleaning system to remove particulates from multiple substrates includes a cleaning tank for applying a cleaning liquid to substrates, a rinse tank for applying a rinsing liquid to substrates, and a robot system. The cleaning tank includes a stationary lid, an input lid, and an output lid. The input and output lids allow a substrate carrier designed to carry an individual substrate to access an inner volume of the cleaning tank for processing. A transport system moves the substrate in the substrate carrier through the inner volume of the cleaning tank by creating a series of gaps between substrates to allow proper processing. The robot system transports substrates through the input and output lids of the cleaning tank, and transports substrates into the rinse tank.