Shared-Terminal Lead Frame for Multi-Rail Capacitor Packaging
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Solution Overview
Problem
Current foil-based capacitor components are limited to single capacitance and require multiple discrete components to service multiple power rails, occupying large space and complicating assembly.
Innovation Solution
A lead frame device with a conductive frame and multiple terminals that supports multiple capacitor stacks, allowing shared cathode and isolated anodes to service multiple power rails, reducing footprint and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple discrete capacitor components are used to service multiple power rails, then each power rail can be serviced with appropriate capacitance, but the space occupied on the PCB increases and assembly complexity increases
Solution Approach 1:
Multiple capacitor components are merged into a single integrated lead frame device. The lead frame structure combines multiple terminals (first terminal connected to common rail, second terminals connected to different power rails) with multiple capacitor stacks in one package, replacing multiple discrete components and reducing PCB footprint while maintaining the ability to service multiple power rails with different capacitance values
2Adaptability or versatility
If multiple discrete capacitor components are used to service multiple power rails, then each power rail can be serviced with appropriate capacitance, but the number of placement operations increases
Solution Approach 1:
Multiple capacitor components are merged into a single integrated lead frame device. The lead frame structure combines multiple terminals (first terminal connected to common rail, second terminals connected to different power rails) with multiple capacitor stacks in one package, replacing multiple discrete components and reducing PCB footprint while maintaining the ability to service multiple power rails with different capacitance values
3Device complexity
If a single capacitor component is used, then the component count is reduced, but the ability to service multiple power rails at different voltage potentials is limited
Solution Approach 1:
The lead frame device is designed with multi-functionality to service multiple power rails. It includes a first terminal connected to a common rail and multiple second terminals (at least two) connected to different power rails through gaps in the lead frame. Each second terminal can be connected to capacitors with different capacitance values, enabling the single device to provide tailored capacitance for each power rail while maintaining a common reference point
Data Source
AI summary
A method of manufacturing a semiconductor device includes providing a conductive frame defining first and second rails, a first terminal disposed between the rails, and a plurality of second terminals extending toward the first terminal from one or both of the rails, disposing a plurality of unencapsulated stacks of capacitor(s) on the frame, each of the stacks having electrically isolated first and second contacts and being disposed with the first contact electrically connected to the first terminal and the second contact electrically connected to one of the second terminals, encapsulating the plurality of stacks, and removing the rails from the frame. The method may include electrically connecting the first terminal to a ground line of the semiconductor device and electrically connecting each of the second terminals to a respective power rail of the semiconductor device associated with a respective voltage potential.