Shared Test Pad Switching for Dense Electronic Component Layouts
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Solution Overview
Problem
The demand for high-density electronic device configurations leads to a challenge in layout area optimization due to the need for numerous test pads, which hinders efficient electrical property measurements.
Innovation Solution
An electronic device design incorporating a substrate with first and second electronic components, switch transistors, and a shared electric pad, allowing separate electrical property measurements when transistors are turned on and preventing measurement when turned off, optimizing layout and testing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple test pads are used for electrical property measurements, then measurement capability is improved, but layout area increases
Solution Approach 1:
Multiple test pads are merged into a single shared electric pad. The patent combines the functions of multiple separate test pads into one shared pad that can be selectively connected to different electronic components through switch transistors, thereby reducing the total area occupied by test pads while maintaining the capability to measure electrical properties of multiple components.
Solution Approach 2:
The shared electric pad is designed to serve multiple functions by being selectively connected to different electronic components. A single pad can measure electrical properties of various components at different time points through the control of switch transistors, making the pad universal and multi-functional rather than dedicated to a single component.
2Measurement precision
If separate test pads are used for each electronic component, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple component-specific test pads into a single shared pad configuration. Instead of having separate dedicated pads for each electronic component, the system uses one shared pad combined with switch transistors to achieve the same measurement functionality, thereby reducing structural complexity.
Solution Approach 2:
Switch transistors are introduced as intermediary elements between the shared electric pad and the electronic components. These transistors act as mediators that enable selective connection and disconnection, allowing the single pad to interface with multiple components without direct permanent connections, thus simplifying the overall pad configuration.
3Measurement precision
If multiple test pads are implemented, then measurement capability is improved, but testing time increases
Solution Approach 1:
The system employs periodic action by sequentially switching connections between the shared electric pad and different electronic components. The switch transistors enable time-multiplexed measurements where each component is measured in a specific time slot, allowing multiple measurements to be performed with a single pad without requiring simultaneous multiple pad operations.
Solution Approach 2:
The test pad configuration is made dynamic through the use of switch transistors that can change connection states in real-time. Instead of static dedicated connections, the system dynamically reconfigures which component is connected to the shared pad during measurement, enabling flexible and efficient use of the single pad resource.
Data Source
AI summary
An electronic device includes a substrate, and a first electronic component, a second electronic component, a first switch transistor and a shared electric pad arranged on the substrate. The first switch transistor is coupled to the first electronic component and the second electronic component. The shared electric pad is coupled to the first electronic component and the second electronic component respectively through the first switch transistor. When the first switch transistor is on, the electrical properties of the first electronic component and the second electronic component can be measured from the shared electric pad. When the first switch transistor is off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the shared electric pad.