Shared Through-Hole Routing for Dense Signal and Ground Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrical device designs require a large number of through holes for signal and ground pathways, leading to design and build-up challenges due to the need for impedance matching and cross-talk mitigation, especially in high-density applications like computer processing or memory devices.
Innovation Solution
Routing multiple electrical pathways, such as signal and ground pathways, through a common through hole in a substrate, with insulation layers to isolate them and manage impedance and crosstalk, allowing for higher pathway densities without increasing substrate real estate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple electrical pathways are routed through individual dedicated through holes, then impedance matching and crosstalk mitigation are achieved, but substrate area consumption increases
Solution Approach 1:
The patent combines multiple electrical pathways (signal and ground) into a single common through hole, routing them through the same physical aperture in the substrate. This merging approach reduces the number of through holes required while maintaining electrical performance through proper internal configuration of the pathways within the shared hole
Solution Approach 2:
The patent implements a nested configuration where multiple pathways are arranged concentrically within the same through hole, with inner pathways surrounded by outer pathways. This nesting allows multiple conductors to occupy the same spatial footprint while maintaining electrical isolation and proper impedance characteristics
2Quantity of substance
If a large number of through holes are used for signal and ground pathways, then electrical connections are established, but design and manufacturing complexity increases
Solution Approach 1:
The patent creates a universal through hole structure that can accommodate multiple different types of electrical pathways (signal, ground, power) within the same physical infrastructure. This multi-functional approach allows a single through hole design to serve multiple routing purposes, reducing overall design complexity
Solution Approach 2:
By merging multiple pathway functions into shared through holes, the patent reduces the total count of through holes required, thereby simplifying both the design process and manufacturing steps such as drilling, plating, and filling operations
3Quantity of substance
If through hole density is increased to accommodate more pathways, then pathway density is improved, but manufacturing challenges increase
Solution Approach 1:
The patent achieves higher pathway density by combining multiple pathways into shared through holes, which reduces the total number of through holes that need to be manufactured. This approach maintains high pathway capacity while avoiding the manufacturing difficulties associated with extremely high through hole densities
Data Source
AI summary
An electronic device comprises a substrate layer comprising a first side and an opposing second side, a through hole passing through the substrate layer between the first side and the second side, a first electrical pathway passing from a first position on the first side of the substrate layer, through a first portion of the through hole, to a first corresponding position on the second side of the substrate layer, a second electrical pathway passing from a second position on the first side of the substrate layer, through a second portion of the through hole, to a corresponding second position on the second side of the substrate layer, and an insulation layer between the first electrical pathway and the second electrical pathway within the through hole, wherein the insulation layer electrically isolates the first electrical pathway from the second electrical pathway.